-
2
-
-
0035251394
-
System modelling of microaccelerometer using piezoelectric thin films
-
Yu J-C and Lan C-B 2001 System modelling of microaccelerometer using piezoelectric thin films Sensors Actuators A 88 178-86
-
(2001)
Sensors Actuators A
, vol.88
, pp. 178-186
-
-
Yu, J.-C.1
Lan, C.-B.2
-
3
-
-
0030233675
-
A new approach to convex corner compensation for anisotropic etching of (100) Si in KOH
-
Zhang Q, Liu L and Li Z 1996 A new approach to convex corner compensation for anisotropic etching of (100) Si in KOH Sensors Actuators A 56 251-4
-
(1996)
Sensors Actuators A
, vol.56
, pp. 251-254
-
-
Zhang, Q.1
Liu, L.2
Li, Z.3
-
4
-
-
0025497671
-
Methods for the fabrication of convex corners in anisotropic etching of (100) silicon in aqueous KOH
-
Offereins H L, Kühl K and Sandmaier H 1990 Methods for the fabrication of convex corners in anisotropic etching of (100) silicon in aqueous KOH Sensors Actuators A 25 9-13
-
(1990)
Sensors Actuators A
, vol.25
, pp. 9-13
-
-
Offereins, H.L.1
Kühl, K.2
Sandmaier, H.3
-
5
-
-
0000818529
-
Compensating comer undercutting of (100) silicon in KOH
-
Offereins H L, Sandmaier H, Marusczyk K, Kühl K and Plettner A 1992 Compensating comer undercutting of (100) silicon in KOH Sensors Mater. 3 127-44
-
(1992)
Sensors Mater.
, vol.3
, pp. 127-144
-
-
Offereins, H.L.1
Sandmaier, H.2
Marusczyk, K.3
Kühl, K.4
Plettner, A.5
-
6
-
-
0025419039
-
Compensation structures for convex corner micromachining in silicon
-
Puers B and Sansen W 1990 Compensation structures for convex corner micromachining in silicon Sensors Actuators A 23 1036-41
-
(1990)
Sensors Actuators A
, vol.23
, pp. 1036-1041
-
-
Puers, B.1
Sansen, W.2
-
7
-
-
0025537261
-
Fabrication of non-underetched convex corners in anisotropic etching of (100) silicon, in aqueous KOH with respect to novel micromechanic elements
-
Mayer G K, Offereins H L, Sandmaier H and Kuhl K 1990 Fabrication of non-underetched convex corners in anisotropic etching of (100) silicon, in aqueous KOH with respect to novel micromechanic elements J. Electrochem. Soc. 137 3947-51
-
(1990)
J. Electrochem. Soc.
, vol.137
, pp. 3947-3951
-
-
Mayer, G.K.1
Offereins, H.L.2
Sandmaier, H.3
K̈uhl, K.4
-
8
-
-
0024680460
-
Compensating corner undercutting in anisotropic etching of (100) silicon
-
Wu X and Ko W H 1989 Compensating corner undercutting in anisotropic etching of (100) silicon Sensors Actuators 18 207-15
-
(1989)
Sensors Actuators
, vol.18
, pp. 207-215
-
-
Wu, X.1
Ko, W.H.2
-
9
-
-
13844291526
-
Multi-level microfluidic channel routing with protected convex corners
-
Kwon J W and Kim E S 2002 Multi-level microfluidic channel routing with protected convex corners Sensors Actuators A 97-98 729-33
-
(2002)
Sensors Actuators A
, vol.97-98
, pp. 729-733
-
-
Kwon, J.W.1
Kim, E.S.2
-
10
-
-
0041978264
-
Photolithography challenges for micromachining industry
-
Craven D 1996 Photolithography challenges for micromachining industry BACUS Symp. pp 1-10
-
(1996)
BACUS Symp.
, pp. 1-10
-
-
Craven, D.1
-
12
-
-
0029390658
-
Photolithography on micromachined 3D surfaces using electrodeposited photoresist
-
Kersten P, Bouwstra S and Petersen J W 1995 Photolithography on micromachined 3D surfaces using electrodeposited photoresist Sensors Actuators A 51 51-4
-
(1995)
Sensors Actuators A
, vol.51
, pp. 51-54
-
-
Kersten, P.1
Bouwstra, S.2
Petersen, J.W.3
-
13
-
-
0041940609
-
Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon
-
Heschel M and Bouwstra S 1998 Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon Sensors Actuators A 70 75-80
-
(1998)
Sensors Actuators A
, vol.70
, pp. 75-80
-
-
Heschel, M.1
Bouwstra, S.2
-
14
-
-
0032648263
-
Spray coating for MEMS interconnects, and advanced packaging applications
-
Luxbacher T and Mirza A 1999 Spray coating for MEMS interconnects, and advanced packaging applications Sensors 1661-4
-
(1999)
Sensors
, vol.16
, pp. 61-64
-
-
Luxbacher, T.1
Mirza, A.2
-
15
-
-
0018030083
-
Fabrication of novel three-dimensional microstructures by the anisotropic etching of (100) and (110) silicon
-
Bassous E 1978 Fabrication of novel three-dimensional microstructures by the anisotropic etching of (100) and (110) silicon IEEE Trans. Electron Devices 25 1178-85
-
(1978)
IEEE Trans. Electron Devices
, vol.25
, pp. 1178-1185
-
-
Bassous, E.1
-
17
-
-
0001039635
-
Applications and simulations of unconventional bulk-micromachining using underetching of (100) silicon planes
-
Schropfer G, de Labachelerie M and Tellier C R 1999 Applications and simulations of unconventional bulk-micromachining using underetching of (100) silicon planes Microsyst. Technol. 5 194-9
-
(1999)
Microsyst. Technol.
, vol.5
, pp. 194-199
-
-
Schropfer, G.1
De Labachelerie, M.2
Tellier, C.R.3
-
18
-
-
0036544447
-
A model explaining mask-corner undercut phenomena in anisotropic silicon etching: A saddle point in the etching-rate diagram
-
Shikida M, Nanbara K, Koizumi T, Sasaki H, Odagaki M, Ando M, Furuta S and Asaumi K 2002 A model explaining mask-corner undercut phenomena in anisotropic silicon etching: a saddle point in the etching-rate diagram Sensors Actuators A 97-98 758-63
-
(2002)
Sensors Actuators A
, vol.97-98
, pp. 758-763
-
-
Shikida, M.1
Nanbara, K.2
Koizumi, T.3
Sasaki, H.4
Odagaki, M.5
Ando, M.6
Furuta, S.7
Asaumi, K.8
-
19
-
-
0029350532
-
Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-on-insulator substrates
-
Benitez A, Esteve J and Bausells J 1995 Bulk silicon microelectromechanical devices fabricated from commercial bonded and etched-back silicon-on-insulator substrates Sensors Actuators A 50 99-103
-
(1995)
Sensors Actuators A
, vol.50
, pp. 99-103
-
-
Benitez, A.1
Esteve, J.2
Bausells, J.3
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