Room temperature nanoindentation creep of nanoscale Ag/Fe multilayers

Materials Letters

Volumn 64, Issue 1, 2010, Pages 53-56

  Zhu, X Y ^a,b   Liu, X J ^a   Zeng, F ^a   Pan, F ^a  

^a TSINGHUA UNIVERSITY   (China)

^b NATIONAL KEY LABORATORY FOR REMANUFACTURING   (China)

Author keywords

Multilayer structure; Nanoindentation; Room temperature creep; Stress exponent

Indexed keywords

CONSTANT LOADS; CREEP PROCESS; CREEP RATES; DISLOCATION GLIDE; EFFECTIVE DIFFUSION; INDENTATION CREEP; MULTILAYER STRUCTURE; NANO SCALE; NANOINDENTATION TESTS; ROOM TEMPERATURE; ROOM TEMPERATURE CREEP; STEADY-STATE CREEP; STRESS EXPONENT; STRESS EXPONENTS;

GRAIN BOUNDARIES; MULTILAYERS; NANOINDENTATION; NANOSTRUCTURED MATERIALS;

CREEP;

EID: 70350735845     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.10.003     Document Type: Article

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