Evaluating modulus and hardness enhancement in evaporated Cu/W multilayers

Acta Materialia

Volumn 55, Issue 1, 2007, Pages 345-351

  Wen, S P ^a   Zong, R L ^a   Zeng, F ^a   Gao, Y ^a   Pan, F ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Cu W multilayers; Hardness; Modulus enhancement; Nanoindentation; Supermodulus

Indexed keywords

COPPER COMPOUNDS; ELASTIC MODULI; EVAPORATION; HARDNESS; INDENTATION; INTERFACES (MATERIALS); TRANSMISSION ELECTRON MICROSCOPY;

CU/W MULTILAYERS; MODULUS ENHANCEMENT; NANOINDENTATION; SUPERMODULUS;

MULTILAYERS;

EID: 33751532146     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.07.043     Document Type: Article

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