Metallographic and Numerical Analysis for Deformation of Conductive Particles in ACF Connection

Journal of Japan Institute of Electronics Packaging

Volumn 7, Issue 7, 2004, Pages 629-634

  Nakanishi, Tohru ^a   Koyamada, Koji ^b   Tsuji, Satoshi ^a   Tanahashi, Kosei ^a   Nishida, Hideyuki ^c  

^a IBM JAPAN LTD   (Japan)

^b KYOTO UNIVERSITY   (Japan)

^c Intl Display Technol Corp Ltd   (Japan)

Author keywords

Anisotropic Conductive Film; Deformation, Conductivity; Finite Element Method; Focused Ion Beam; Lift Out; Transmission Electron Microscopy

Indexed keywords

EID: 70350732646     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.7.629     Document Type: Article

References (5)

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