-
1
-
-
44649135687
-
Energy minimization- based analysis of electrowetting for microelectronics cooling applications
-
Bahadur V and Garimella S V 2008 Energy minimization- based analysis of electrowetting for microelectronics cooling applications Microelectron. J. 39 957-65
-
(2008)
Microelectron. J.
, vol.39
, Issue.7
, pp. 957-965
-
-
Bahadur, V.1
Garimella, S.V.2
-
2
-
-
34648828867
-
Development and characterization of thermal enhancement structures for single-phase liquid cooling in microelectronics systems
-
Zhang H Y et al 2007 Development and characterization of thermal enhancement structures for single-phase liquid cooling in microelectronics systems Heat Transfer Eng. 28 997-1007
-
(2007)
Heat Transfer Eng.
, vol.28
, Issue.12
, pp. 997-1007
-
-
Zhang, H.Y.1
Al, E.2
-
3
-
-
27644500192
-
Active cooling substrates for thermal management of microelectronics
-
Wang Y et al 2005 Active cooling substrates for thermal management of microelectronics IEEE Trans. Compon. Pack. Technol. 28 477-83
-
(2005)
IEEE Trans. Compon. Pack. Technol.
, vol.28
, Issue.3
, pp. 477-483
-
-
Wang, Y.1
Al, E.2
-
4
-
-
0036767710
-
Current and future miniature refrigeration cooling technologies for high power microelectronics
-
Phelan P E, Chiriac V A and Lee T Y T 2002 Current and future miniature refrigeration cooling technologies for high power microelectronics IEEE Trans. Compon. Pack. Technol. 25 356-65
-
(2002)
IEEE Trans. Compon. Pack. Technol.
, vol.25
, Issue.3
, pp. 356-365
-
-
Phelan, P.E.1
Chiriac, V.A.2
Lee, T.Y.T.3
-
5
-
-
0029373980
-
A dielectric surface coating technique to enhance boiling heat-transfer from high-power microelectronics
-
Oconnor J P, You S M and Price D C 1995 A dielectric surface coating technique to enhance boiling heat-transfer from high-power microelectronics IEEE Trans. Compon. Pack. Manuf. Technol. A 18 656-63
-
(1995)
IEEE Trans. Compon. Pack. Manuf. Technol.
, vol.18
, Issue.3
, pp. 656-663
-
-
Oconnor, J.P.1
You, S.M.2
Price, D.C.3
-
7
-
-
2542422682
-
Design of a high-density thermal inkjet using heat transfer from CVD diamond
-
Baek S S, Choi B and Oh Y 2004 Design of a high-density thermal inkjet using heat transfer from CVD diamond J. Micromech. Microeng. 14 750-60
-
(2004)
J. Micromech. Microeng.
, vol.14
, Issue.5
, pp. 750-760
-
-
Baek, S.S.1
Choi, B.2
Oh, Y.3
-
8
-
-
23944519499
-
'Blinking bubble' micropump with microfabricated heaters
-
Yin Z Z and Prosperetti A 2005 'Blinking bubble' micropump with microfabricated heaters J. Micromech. Microeng. 15 1683-91
-
(2005)
J. Micromech. Microeng.
, vol.15
, Issue.9
, pp. 1683-1691
-
-
Yin, Z.Z.1
Prosperetti, A.2
-
9
-
-
15544369031
-
Measurements of micro bubble nucleation temperatures in DNA solutions
-
Deng P G, Lee Y K and Cheng P 2005 Measurements of micro bubble nucleation temperatures in DNA solutions J. Micromech. Microeng. 15 564-74
-
(2005)
J. Micromech. Microeng.
, vol.15
, Issue.3
, pp. 564-574
-
-
Deng, P.G.1
Lee, Y.K.2
Cheng, P.3
-
10
-
-
57249091653
-
Bubble nucleation in an explosive micro-bubble actuator
-
van den Broek D M and Elwenspoek M 2008 Bubble nucleation in an explosive micro-bubble actuator J. Micromech. Microeng. 18 064003
-
(2008)
J. Micromech. Microeng.
, vol.18
, Issue.6
, pp. 064003
-
-
Van Den Broek, D.M.1
Elwenspoek, M.2
-
11
-
-
57249090757
-
Fabrication of a bubble-driven arrayed actuator for a tactile display
-
Shikida M et al 2008 Fabrication of a bubble-driven arrayed actuator for a tactile display J. Micromech. Microeng. 18 065012
-
(2008)
J. Micromech. Microeng.
, vol.18
, Issue.6
, pp. 065012
-
-
Shikida, M.1
Al, E.2
-
12
-
-
40449093024
-
Kinematically stabilized microbubble actuator arrays
-
Wu X S et al 2008 Kinematically stabilized microbubble actuator arrays J. Microelectromech. Syst. 17 124-32
-
(2008)
J. Microelectromech. Syst.
, vol.17
, Issue.1
, pp. 124-132
-
-
Wu, X.S.1
Al, E.2
-
14
-
-
0242349592
-
Short-time-transient surfactant dynamics and Marangoni convection around boiling nuclei
-
Wasekar V M and Manglik R N 2003 Short-time-transient surfactant dynamics and Marangoni convection around boiling nuclei ASME J. Heat Trans. 125 858-66
-
(2003)
ASME J. Heat Trans.
, vol.125
, Issue.5
, pp. 858-866
-
-
Wasekar, V.M.1
Manglik, R.N.2
-
16
-
-
0035486002
-
Transport phenomenon of a vapour bubble attached to a downward surface
-
Peng X F, Huang Y J and Lee D J 2001 Transport phenomenon of a vapour bubble attached to a downward surface Int. J. Therm. Sci. 40 797-803
-
(2001)
Int. J. Therm. Sci.
, vol.40
, Issue.9
, pp. 797-803
-
-
Peng, X.F.1
Huang, Y.J.2
Lee, D.J.3
-
17
-
-
15544369031
-
Measurements of micro bubble nucleation temperatures in DNA solutions
-
Deng P G, Lee Y K and Cheng P 2005 Measurements of micro bubble nucleation temperatures in DNA solutions J. Micromech. Microeng. 15 564-74
-
(2005)
J. Micromech. Microeng.
, vol.15
, Issue.3
, pp. 564-574
-
-
Deng, P.G.1
Lee, Y.K.2
Cheng, P.3
-
18
-
-
23844528837
-
Microscale heterogeneous boiling on smooth surfaces-from bubble nucleation to bubble dynamics
-
Li J and Peterson G P 2005 Microscale heterogeneous boiling on smooth surfaces-from bubble nucleation to bubble dynamics Int. J. Heat Mass Transfer 48 4316-32
-
(2005)
Int. J. Heat Mass Transfer
, vol.48
, Issue.21-22
, pp. 4316-4332
-
-
Li, J.1
Peterson, G.P.2
-
19
-
-
0000756672
-
Thermal bubble formation on polysilicon micro resistors
-
Lin L W, Pisano A P and Carey V P 1998 Thermal bubble formation on polysilicon micro resistors ASME J. Heat Trans. 120 735-42
-
(1998)
ASME J. Heat Trans.
, vol.120
, Issue.3
, pp. 735-742
-
-
Lin, L.W.1
Pisano, A.P.2
Carey, V.P.3
-
20
-
-
0037298083
-
Bubble sweeping and jet flows during nucleate boiling of subcooled liquids
-
Wang H et al 2003 Bubble sweeping and jet flows during nucleate boiling of subcooled liquids Int. J. Heat Mass Transfer 46 863-9
-
(2003)
Int. J. Heat Mass Transfer
, vol.46
, Issue.5
, pp. 863-869
-
-
Wang, H.1
Al, E.2
-
21
-
-
2442459963
-
Bubble-top jet flow on microwires
-
Wang H et al 2004 Bubble-top jet flow on microwires Int. J. Heat Mass Transfer 47 2891-900
-
(2004)
Int. J. Heat Mass Transfer
, vol.47
, Issue.14-16
, pp. 2891-2900
-
-
Wang, H.1
Al, E.2
-
22
-
-
16844367800
-
Investigation of bubble-top jet flow during subcooled boiling on wires
-
Wang H et al 2005 Investigation of bubble-top jet flow during subcooled boiling on wires Int. J. Heat Fluid Flow 26 485-94
-
(2005)
Int. J. Heat Fluid Flow
, vol.26
, Issue.3
, pp. 485-494
-
-
Wang, H.1
Al, E.2
-
23
-
-
33745341889
-
Numerical analysis of the dynamics of moving vapor bubbles
-
Christopher D M, Wang H and Peng X F 2006 Numerical analysis of the dynamics of moving vapor bubbles Int. J. Heat Mass Transfer 49 3626-33
-
(2006)
Int. J. Heat Mass Transfer
, vol.49
, Issue.19-20
, pp. 3626-3633
-
-
Christopher, D.M.1
Wang, H.2
Peng, X.F.3
-
24
-
-
33750736657
-
Microbubble return phenomena during subcooled boiling on small wires
-
Wang H et al 2007 Microbubble return phenomena during subcooled boiling on small wires Int. J. Heat Mass Transfer 50 163-72
-
(2007)
Int. J. Heat Mass Transfer
, vol.50
, Issue.1-2
, pp. 163-172
-
-
Wang, H.1
Al, E.2
-
25
-
-
47349093141
-
Bubble oscillation on thin wire during subcooled boiling
-
Lu J F and Peng X F 2008 Bubble oscillation on thin wire during subcooled boiling Int. J. Heat Mass Transfer 51 4461-69
-
(2008)
Int. J. Heat Mass Transfer
, vol.51
, Issue.17-18
, pp. 4461-4469
-
-
Lu, J.F.1
Peng, X.F.2
-
27
-
-
33645088074
-
The motion of bubbles in a vertical temperature gradient
-
Young N O, Goldstein J S and Block M J 1959 The motion of bubbles in a vertical temperature gradient J. Fluid Mech. 6 350-6
-
(1959)
J. Fluid Mech.
, vol.6
, Issue.3
, pp. 350-356
-
-
Young, N.O.1
Goldstein, J.S.2
Block, M.J.3
-
31
-
-
0031165451
-
Lumped models of gas bubbles in thermal gradients
-
Ramos J I 1997 Lumped models of gas bubbles in thermal gradients Appl. Math. Model. 21 371-86
-
(1997)
Appl. Math. Model.
, vol.21
, Issue.6
, pp. 371-386
-
-
Ramos, J.I.1
-
32
-
-
0037007185
-
Coalescence of bubbles in nucleate boiling on microheaters
-
Chen T L and Chung J N 2002 Coalescence of bubbles in nucleate boiling on microheaters Int. J. Heat Mass Transfer 45 2329-41
-
(2002)
Int. J. Heat Mass Transfer
, vol.45
, Issue.11
, pp. 2329-2341
-
-
Chen, T.L.1
Chung, J.N.2
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