Wafer level bulk titanium ICP etching using SU8 as an etching mask

Journal of Micromechanics and Microengineering

Volumn 19, Issue 9, 2009, Pages

  Zhao, Gang ^a   Shu, Qiong ^a   Yao Tian, ^a   Zhang, Yiming ^a   Chen, Jing ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BULK TITANIUM; COIL POWER; COMB-FINGER STRUCTURE; DEEP ETCHING; DEEP GROOVE; DEEP REACTIVE ION ETCHING; ETCH PROFILE; ETCH RATES; ETCHING MASKS; ETCHING RATE; EXCELLENT CORROSION RESISTANCES; HARD MASKS; HARSH ENVIRONMENT; HIGH ASPECT RATIO; HIGH ASPECT RATIO STRUCTURES; ICP ETCHING; IN-VIVO; MASK MATERIALS; MICROELECTROMECHANICAL SYSTEMS; PLATEN POWER; PROCESS PARAMETERS; SIDEWALL PROFILES; TITANIUM SUBSTRATES; TITANIUM-BASED; WAFER LEVEL; WAFER UNIFORMITY;

ASPECT RATIO; CORROSION RESISTANCE; INDUCTIVELY COUPLED PLASMA; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; PROCESS ENGINEERING; SURFACE ROUGHNESS; TITANIUM;

REACTIVE ION ETCHING;

EID: 70350637520     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/9/095006     Document Type: Article

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