Optimizing SMT performance using comparisons of efficiency between different systems technique in DEA

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 256-264

  Al Refaie, Abbas ^a  

^a UNIVERSITY OF JORDAN   (Jordan)

Author keywords

Comparisons of efficiency between different systems (CEBDS); Data envelopment analysis (DEA); Surface mount technology (SMT); Taguchi's accumulation analysis method

Indexed keywords

ANALYSIS METHOD; CATEGORICAL DATA; COMPARISONS OF EFFICIENCY BETWEEN DIFFERENT SYSTEMS (CEBDS); DECISION MAKING UNIT; DEFECT COUNTS; INFLUENTIAL FACTORS; KEY FACTORS; OPTIMAL LEVEL; PROCESS PERFORMANCE; QUALITY COSTS; REFLOW TEMPERATURES; SIGNIFICANT FACTORS; SMT PROCESS; SURFACE-MOUNT TECHNOLOGY (SMT); TAGUCHI; TAGUCHI'S ACCUMULATION ANALYSIS METHOD;

DATA ENVELOPMENT ANALYSIS; DECISION MAKING; DEFECTS; LINEAR PROGRAMMING; MOUNTINGS; OPTIMIZATION; POWER CONVERTERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; REGRESSION ANALYSIS; SURFACE MOUNT TECHNOLOGY;

ANALYSIS OF VARIANCE (ANOVA);

EID: 70350340045     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2029238     Document Type: Article

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