Copper plating on the polyimide film by electroless plating techniques for EMI shielding

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 12, 2009, Pages 7065-7070

  Ji, Eun Sun ^a   Cha, Hyun Gil ^a   Kim, Chang Woo ^a   Kang, Dong In ^a   Kang, Young Soo ^a  

^a Sogang University   (South Korea)

Author keywords

Copper polyimide film; Electroless plating; Emi

Indexed keywords

BASE SOLUTION; COPPER LAYER; E-M WAVES; ELECTROLESS COPPER PLATING; EMI; EMI SHIELDING; FILM SURFACES; MODIFIED POLYIMIDES; MOLAR RATIO; PLATED FILMS; POLYIMIDE FILM; SEM;

COPPER; COPPER PLATING; ELECTROLESS PLATING; ELECTROMAGNETIC PULSE; ELECTROPLATING; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SHIELDING; SILVER;

FILM PREPARATION;

EID: 70350238645     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.1600     Document Type: Conference Paper

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