Superhydrophilic-superhydrophobic template: A simple approach to micro- and nanostructure patterning of TiO2 films

Journal of the Electrochemical Society

Volumn 156, Issue 11, 2009, Pages

  Lai, Yuekun ^a,b   Huang, Jianying ^c   Gong, Jiaojiao ^a   Huang, Yongxia ^a   Wang, Chenglin ^a   Chen, Zhong ^b   Lin, Changjian ^a  

^a XIAMEN UNIVERSITY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c FUJIAN INSTITUTE OF RESEARCH ON THE STRUCTURE OF MATTER   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON PROBE MICRO ANALYZER; HARMFUL CHEMICALS; LOW TEMPERATURES; MICRO AND NANOSTRUCTURES; MICROPATTERNS; MILD REACTION CONDITIONS; NANO SCALE; PHOTOCATALYTIC LITHOGRAPHY; SCALE PATTERN; SIMPLE APPROACH; STRUCTURE AND MORPHOLOGY; SUPER-HYDROPHILIC; SUPERHYDROPHOBIC; TIO; VERTICALLY ALIGNED;

FABRICATION; HYDROPHOBICITY; LITHOGRAPHY; OPTOELECTRONIC DEVICES; SCANNING ELECTRON MICROSCOPY; SENSOR ARRAYS;

OPTICAL MICROSCOPY;

EID: 70349733216     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3216032     Document Type: Article

References (45)

1. R. Wang, K. Hashimoto, A. Fujishima, M. Chikuni, E. Kojima, A. Kitamura, M. Shimohigoshi, and T. Watanabe, Nature (London).388, 431 (1997).
2. K. Ichimura, S. K. Oh, and M. Nakagawa, Science.288, 1624 (2000).
3. X. F. Gao and L. Jiang, Nature (London).432, 36 (2004).
4. E. Balaur, J. M. Macak, L. Taveira, and P. Schmuki, Electrochem. Commun 7, 1066 (2005).
5. X. Yu, Z. Q. Wang, Y. G. Jiang, F. Shi, and X. Zhang, Adv. Mater. (Weinheim, Ger.) 17, 1289 (2005).
6. P. Aussillous and D. Qúŕ, Nature (London).411, 924 (2001).
7. L. Feng, S. Li, Y. Li, H. Li, L. Zhang, J. Zhai, Y. Song, B. Liu, L. Jiang, and D. B. Zhu, Adv. Mater. (Weinheim, Ger.) 14, 1857 (2002).
8. F. C. Cebeci, Z. Z. Wu, L. Zhai, R. E. Cohen, and M. F. Rubner, Langmuir.22, 2856 (2006).
9. Y. Gao, Y. Masuda, and K. Koumoto, Chem. Mater 16, 1062 (2004).
10. Y. Masuda, N. Kinoshita, F. Sato, and K. Koumoto, Cryst. Growth Des 6, 75 (2006).
11. K. Koumoto, N. Saito, Y. F. Gao, Y. Masuda, and P. X. Zhu, Bull. Chem. Soc. Jpn 81, 1337 (2008).
12. T. Balgar, S. Franzka, E. Hasselbrink, and N. Hartmann, Appl. Phys. A: Mater. Sci. Process 82, 15 (2006).
13. A. Matsuda, T. Sasaki, K. Tadanaga, M. Tatsumisago, and T. Minami, Chem. Mater 14, 2693 (2002).
14. X. T. Zhang, O. Sato, and A. Fujishima, Langmuir.20, 6065 (2004).
15. K. Tadanaga, J. Morinaga, A. Matsuda, and T. Minami, Chem. Mater 12, 590 (2000).
16. O. K. Varghese, D. Gong, M. Paulose, K. G. Ong, E. C. Dickey, and C. A. Grimes, Adv. Mater. (Weinheim, Ger.) 15, 624 (2003).
17. Y. Y. Zhang, W. Y. Fu, H. B. Yang, Q. Qi, Y. Zeng, T. Zhang, R. X. Ge, and G. Zou, Appl. Surf. Sci. 254, 5545 (2008).
18. S. H. Kang, J. Y. Kim, Y. Kim, H. S. Kim, and Y. E. Sun, J. Phys. Chem. C 111, 9614 (2007).
19. R. Vogel, P. Meredith, I. Kartini, M. Harvey, J. D. Riches, A. Bishop, N. Heckenberg, M. Trau, and H. Rubinsztein-Dunlop, ChemPhysChem.4, 595 (2003).
20. Y. K. Lai, L. Sun, Y. C. Chen, H. F. Zhuang, C. J. Land J. W. ChJ. Electrochem. Soc. 153, D123 (2006).
21. Z. Y. Liu, X. T. Zhang, S. Nishimoto, T. Murakami, and A. Fujishima, Environ. Sci. Technol 42, 8547 (2008).
22. Y. Masuda, S. Ieda, and K. Koumoto, Langmuir.19, 4415 (2003).
23. R. Michel, J. W. Lussi, G. Csucs, I. Reviakine, G. Danuser, B. Ketterer, J. A. Hubbell, M. Textor, and N. D. Spencer, Langmuir.18, 3281 (2002).
24. P. Yang, M. Yang, S. L. Zou, J. Y. Xie, and W. T. Yang, J. Am. Chem. Soc. 129, 1541 (2007).
25. D. W. Gong, C. A. Grimes, and O. K. Varghese, J. Mater. Res 16, 3331 (2001).
26. L. V. Taveira, J. M. Macak, H. L. Tsuchiya, F. P. Dick, and P. Schmuki, J. Electrochem. Soc. 152, B405 (2005).
27. A. Seyeux, S. Berger, D. LeClere, A. Valota, P. Skeldon, G. E. Thompson, J. Kunze, and P. Schmuki, J. Electrochem. Soc. 156, K17 (2009).
28. Y. K. Lai, H. F. Zhuang, L. Sun, Z. Chen, and C. J. LElectrochim. Acta 54, 6536 (2009).
29. J. M. Macak, K. Sirotna, and P. Schmuki, Electrochim. Acta 50, 3679 (2005).
30. L. V. Taveira, A. A. Saguees, J. M. Macak, and P. Schmuki, J. Electrochem. Soc. 155, C293 (2008).
31. Y. K. Lai, C. J. LH. Wang, J. Y. Huang, H. F. Zhuang, and L. Sun, Electrochem. Commun 10, 387 (2008).
32. H. Haick and Y. Paz, J. Phys. Chem. B 105, 3045 (2001).
33. W. Kubo, T. Tatsuma, A. Fujishima, and H. Kobayashi, J. Phys. Chem. B 108, 3005 (2004).
34. Y. K. Lai, C. J. LJ. Y. Huang, H. F. Zhuang, L. Sun, and T. Nguyen, Langmuir.24, 3867 (2008).
35. Y. K. Lai, X. F. Gao, H. F. Zhuang, J. Y. Huang, C. J. Land L. Jiang, Adv. Mater. (Weinheim, Ger.) In press. [DOI: 10.1002/adma.200900686]
36. H. Sugimura, T. Hanji, O. Takai, T. Masuda, and H. Misawa, Electrochim. Acta 47, 103 (2001).
37. D. Schondelmaier, S. Cramm, R. Klingeler, J. MorenzCh. Zilkens, and W. Eberhardt, Langmuir.18, 6242 (2002).
38. J. D. J. S. Samuel and J. Rühe, Langmuir.20, 10080 (2004).
39. Y. Y. Wu, M. Kouno, N. Saito, F. A. Nae, Y. Inoue, and O. Takai, Thin Solid Films 515, 4203 (2007).
40. B. Zhao, J. S. Moore, and D. J. Beebe, Science.291, 1023 (2001).
41. H. Sorribas, C. Padeste, and L. Tiefenauer, Biomaterials.23, 893 (2002).
42. Y. Ito, Biomaterials.20, 2333 (1999).
43. L. Zhai, M. C. Berg, F. C. Cebeci, Y. Kim, J. M. Milwid, M. F. Rubner, and R. E. Cohen, Nano Lett 6, 1213 (2006).
44. T. Ishizaki, H. Sakurai, N. Saito, and O. Takai, Surf. Coat. Technol 202, 5535 (2008).
45. N. Shirahata and A. Hozumi, Chem. Mater 17, 20 (2005).