MCM-D technology for integrated passives components

Proceedings of the International Conference on Microelectronics, ICM

Volumn 2000-January, Issue , 1999, Pages 137-140

  Pieters, P ^a   De Raedt, W ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

Capacitors; Copper; Dielectric losses; Dielectric substrates; Dielectric thin films; Integrated circuit technology; Reflection; Resistors; Temperature; Testing

Indexed keywords

CAPACITORS; COPPER; DIELECTRIC LOSSES; FILM PREPARATION; MICROELECTRONICS; REFLECTION; RESISTORS; TEMPERATURE; TESTING; THIN FILMS;

DIELECTRIC SUBSTRATES; DIELECTRIC THIN FILMS; INTEGRATED CIRCUIT TECHNOLOGY; INTEGRATED PASSIVE COMPONENTS; INTEGRATED PASSIVES; PASSIVE STRUCTURES; TELECOMMUNICATION CIRCUITS; THIN FILM MULTILAYERS;

INTEGRATED CIRCUIT TESTING;

EID: 84949786873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICM.2000.884824     Document Type: Conference Paper

References (4)

1. th International Conference and Exhibition on Multichip Modules, MCM'95, Denver, CO, April 19-21, 1995.
2. V. B. Krishnamurthy et al., Use of BCB in High Frequency MCM Interconnects, IEEE Trans. on CPMT part B, vol. 19, no. 1, Jan. 1996.
3. th International Conference and Exhibition on Multichip Modules, MCM'97, Denver, CO, April 2-4, 1997, pp. 357-362.
4. J. N. Burghartz, et al., Spiral Inductors and Transmission Lines in Silicon Technology using Copper-Damascene Interconnects and Low-Loss substrates, IEEE Trans. on MTT, vol.45, no. 10, October 1997.