Micro-nano interconnect between gold bond pads and copper nano-wires embedded in a polymer template

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1470-1474

  Stam, F ^a   Razeeb, K M ^a   Salwa, S ^a   Mathewson, A ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BOND PAD; COPPER WIRES; ELECTRICAL INSULATION; ELECTRICAL MEASUREMENT; FLIP-CHIP BONDING; GOLD STUD BUMP; METAL WIRES; MICRO-NANO; MICROELECTRONICS PACKAGING; PARALLEL ARRAYS; POLYCARBONATE TEMPLATE; POLYMER TEMPLATES; SUBMICRON; TEST CHIPS;

CHIP SCALE PACKAGES; COPPER; FLIP CHIP DEVICES; GOLD; MICROELECTRONICS;

WIRE;

EID: 70349686460     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074206     Document Type: Conference Paper

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