Biostability issues of flash gold surfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1071-1079

  Beshchasna, N ^a   Adolphi, B ^a   Granovsky, S ^b   Uhlemann, J ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b MOSCOW STATE UNIVERSITY   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

BIOSTABILITY; BLOOD PLASMA; CHEMICAL COMPOSITIONS; CIRCULATION SYSTEMS; CORROSIVE ENVIRONMENT; ELECTRICAL PROPERTY; ELECTROLESS; ELECTROLESS NI; ELECTRONIC DEVICE; FOREIGN SUBSTANCES; GOLD LAYER; GOLD SURFACES; HUMAN BODIES; LASER PROFILOMETRY; LAYER CONFIGURATION; LIVING TISSUES; MASS LOSS; STRUCTURE INTEGRITY; WETTING PROPERTY;

ANGLE MEASUREMENT; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BLOOD; CONTACT ANGLE; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; GOLD; NICKEL; OPTICAL MICROSCOPY; OPTICAL PROPERTIES; PALLADIUM; PHOTOELECTRON SPECTROSCOPY; TOXIC MATERIALS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 70349658248     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074145     Document Type: Conference Paper

References (13)

1. Meng, C. K., Selvamuniandy, T. S. and C. Gurumurthy: Discoloration related failure mechanism and its root cause in Electroless Nickel Immersion Gold (ENIG) Pad metallur- gical surface finish", Proceedings of 11th IPFA, Taiwan, 2004.
2. Reyes, W., Peter, E. St., Bolger, G. and Sie, A. H.: "Factors influencing thin gold performance for separable connectors", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT 4, No. 4, December 1981.
3. Lin, X.-Y. and J.-G. Zhang: "Properties of Corrosion Stains on Thin Gold Plating", Electrical Contacts 2002, Proceedings of 48th IEEE Holm Conference on Electric Contacts.
4. Coyle, R. J., D. E. Hodges, Popps, M. Andrew, D. P. Cullen, G. M. Wenger and P. P. Solan: The effect of Modifications to the Nickel/Gold Surface Finish on Assembly Quality and Attachment Reliability of a Plastic Ball Grid Ar-ray", IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 4, 2003.
5. Landis W. J., Martin J. R.: "X-ray photoelectron spectroscopy applied to gold-decorated mineral standards of biological interest", J. Vac. Sci. Technol. A Vol. 2, Issue 2, pp. 1108 - 1111, 1984.
6. Kim K.S., Winograd N.: "X-ray photoelectron spectroscopic studies of nickel-oxygen surfaces using oxygen and argon ion-bombardment", J of Applied Surface Science 43, 1974, pp. 625 - 643.
7. Lia, H., Lib, H., Daia, W.-L., Wanga, W., Fanga, Z. and Denga, J.-F.: "XPS studies on surface electronic characteristics of Ni-B and Ni-P amorphous alloy and its correlation to their catalytic properties", J of Applied Surface Science Vol. 152, Issues 1-2 (1999), pp. 25-34.
8. Lopez, M. C., Galiana, B., Algora, C., Rey-Stolle, I., Gabas, M. and Ramos-Barrado, J. R.: "Chemical characteri-zation by XPS of Cu/Ge ohmic contacts to n- GaAs", J of Applied Surface Science 253 (2007), pp. 5062-5066.
9. McIntyre N.S., Cook M.G.: J of Anal. Chem. 47(1975), p. 2208; http://srdata.nist.gov/xps/elm Spectra-query.aspx?Elm1=Ni&LD1=3p&Elm2= &LD2= &Elm3=&LD3=&Elm4=&LD4=&sType=PE.
10. Xie, J., Sun, M., Pecht, M. and Barbe, D. F.: "Why gold flash can be detrimental to long-term reliability", J of Elec-tronics Packaging, Vol. 126, March 2004, pp. 37 - 40.
11. Kulwanoski, G., M. Gaynes, A. Smith and B. Darrow: "Electrical contact failure mechanisms relevant to electronic packages", Proceedings of 37th IEEE Holm Conference on Electrical Contacts, 1991, Chicago, IL, USA.
12. Dunn, C., R. W. Johnson, M. Bozack, C. Kromis, J. Harris and M. Knadler: "Assembling MCMS with alternate plating finish, Electronics Packaging Prod., 73, 1997.
13. Kim, J.-K. and Benny, P. L.: "Effects of metalization characteristics on gold wire bondability of organic printed circuit boards", J of Electronic Materials, Vol. 30, No 8, 2001, pp. 1001 - 1011.