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Volumn , Issue , 2009, Pages 1630-1635

Use of the finite element method for the modeling of multi-layered power/ground planes with small features

Author keywords

[No Author keywords available]

Indexed keywords

ADAPTIVE TRIANGULAR MESHES; ADMITTANCE MATRICES; COMPUTATIONAL COSTS; GEOMETRICAL FEATURES; MULTI-LAYERED; SMALL FEATURES; SQUARE MESHES; VERTICAL COUPLING;

EID: 70349655235     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074233     Document Type: Conference Paper
Times cited : (14)

References (11)
  • 2
    • 34347396973 scopus 로고    scopus 로고
    • May
    • A. E. Engin, K. Bharath, and M. Swaminathan, "Multilayered finitedifference method (m-fdm) for modeling of package and printed circuit board planes," IEEE Trans. Electromag. Compat., vol.49, no.2, pp. 441-447, May 2007.
    • (2007) IEEE Trans. Electromag. Compat. , vol.49 , Issue.2 , pp. 441-447
    • Engin, A.E.1    Bharath, K.2    Swaminathan, M.3
  • 4
    • 44449148385 scopus 로고    scopus 로고
    • Delaunay-voronoi modeling of power-ground planes with source port correction
    • May
    • K.-B. Wu, G.-H. Shiue, W.-D. Guo, C.-M. Lin, and R.-B. Wu, "Delaunay-voronoi modeling of power-ground planes with source port correction," IEEE Trans. on Adv. Packaging, vol.31, no.2, pp. 303-310, May 2008.
    • (2008) IEEE Trans. on Adv. Packaging , vol.31 , Issue.2 , pp. 303-310
    • Wu, K.-B.1    Shiue, G.-H.2    Guo, W.-D.3    Lin, C.-M.4    Wu, R.-B.5
  • 5
    • 33747625200 scopus 로고    scopus 로고
    • Circuit models for power bus structures on printed circuit boards using a hybrid fem-spice method
    • August
    • C. Guo and T. H. Hubing, "Circuit models for power bus structures on printed circuit boards using a hybrid fem-spice method," IEEE Trans. on Adv. Packaging, vol.29, no.3, pp. 441-447, August 2006.
    • (2006) IEEE Trans. on Adv. Packaging , vol.29 , Issue.3 , pp. 441-447
    • Guo, C.1    Hubing, T.H.2
  • 6
    • 70349683350 scopus 로고    scopus 로고
    • Multi-layer finite element method (MFEM) for the modeling of package power/ground planes
    • January
    • K. Bharath and M. Swaminathan, "Multi-layer finite element method (mfem) for the modeling of package power/ground planes," Georgia Tech invention disclosure 4719, January 2009.
    • (2009) Georgia Tech invention disclosure 4719
    • Bharath, K.1    Swaminathan, M.2
  • 7
    • 0015331132 scopus 로고
    • The planar circuit - An approach to microwave integrated circuitry
    • April
    • T. Okoshi and T. Miyoshi, "The planar circuit - an approach to microwave integrated circuitry," IEEE Trans. Microwave Theory Tech., vol.MTT-20, pp. 245-252, April 1972.
    • (1972) IEEE Trans. Microwave Theory Tech. , vol.MTT-20 , pp. 245-252
    • Okoshi, T.1    Miyoshi, T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.