메뉴 건너뛰기




Volumn 106, Issue 6, 2009, Pages

Reducing thermal conductivity of thermoelectric materials by using a narrow wire geometry

Author keywords

[No Author keywords available]

Indexed keywords

COVALENT BONDING; COVALENTLY BONDED; FIGURE OF MERIT; HIGH THERMAL CONDUCTIVITY; LOW MOBILITY; MEAN FREE PATH; MEAN FREE PATH OF PHONONS; NARROW WIRES; SILICON WIRES; TEMPERATURE RANGE; THERMOELECTRIC MATERIAL; WIRE DIAMETER; WIRE GEOMETRIES;

EID: 70349651758     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3212982     Document Type: Article
Times cited : (22)

References (24)
  • 2
    • 0001173915 scopus 로고
    • 0163-1829,. 10.1103/PhysRevB.47.12727
    • L. D. Hicks and M. S. Dresselhaus, Phys. Rev. B 0163-1829 47, 12727 (1993). 10.1103/PhysRevB.47.12727
    • (1993) Phys. Rev. B , vol.47 , pp. 12727
    • Hicks, L.D.1    Dresselhaus, M.S.2
  • 4
    • 0035846181 scopus 로고    scopus 로고
    • Thin-film thermoelectric devices with high room-temperature figures of merit
    • DOI 10.1038/35098012
    • R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Nature (London) 0028-0836 413, 597 (2001). 10.1038/35098012 (Pubitemid 32964053)
    • (2001) Nature , vol.413 , Issue.6856 , pp. 597-602
    • Venkatasubramanian, R.1    Siivola, E.2    Colpitts, T.3    O'Quinn, B.4
  • 18
  • 20
    • 0000605432 scopus 로고
    • 0022-3719,. 10.1088/0022-3719/5/21/011
    • J. P. Michenaud and J. P. Issi, J. Phys. C 0022-3719 5, 3061 (1972). 10.1088/0022-3719/5/21/011
    • (1972) J. Phys. C , vol.5 , pp. 3061
    • Michenaud, J.P.1    Issi, J.P.2
  • 21
    • 70349638954 scopus 로고
    • ISSP Technical Report No. B18.
    • B. S. Farag and S. Tanuma, ISSP Technical Report No. B18, 1976.
    • (1976)
    • Farag, B.S.1    Tanuma, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.