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Volumn 76, Issue 11, 2005, Pages 1-4
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Reduction of contact resistance at terminations of bismuth wire arrays
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Author keywords
[No Author keywords available]
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Indexed keywords
ARRAYS;
COPPER;
ELECTRIC RESISTANCE;
ELECTRIC WIRE;
ELECTRODES;
IONS;
PLATING;
POLYCRYSTALLINE MATERIALS;
SAMPLING;
SEEBECK EFFECT;
CONTACT RESISTANCE;
ION PLATING;
PROBE ELECTRODES;
WIRE ARRAYS;
BISMUTH;
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EID: 28444448047
PISSN: 00346748
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2126952 Document Type: Review |
Times cited : (29)
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References (15)
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