Fabrication of precisely controlled silicon wire and cone arrays by electrochemical etching

Materials Letters

Volumn 63, Issue 29, 2009, Pages 2567-2569

  Seo, Hong Seok ^a   Li, Xiaopeng ^a   Um, Han Don ^a   Yoo, Bongyoung ^a   Kim, Jae Hyun ^b   Kim, Kang Pil ^b   Cho, Yong Woo ^a   Lee, Jung Ho ^a  

^a Hanyang University   (South Korea)

^b Daegu Gyeongbuk Institute of Science and Technology   (South Korea)

Author keywords

Cones; Electrochemical etching; Microstructure; Surfaces; Wires

Indexed keywords

CHEMICAL ETCHING; COMBINED TREATMENT; CONE ARRAYS; ETCHING TIME; FIELD EMITTER; HIGH-DENSITY; HIGH-DENSITY INTEGRATION; INTEGRATED ELECTRONICS; MICRO-SCALES; ORDERED ARRAY; SHARP TIP; SILICON WIRES; THERMOELECTRIC DEVICES; WIRE DIAMETER;

FABRICATION; MICROSTRUCTURE; WIRE;

ELECTROCHEMICAL ETCHING;

EID: 70349488024     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.09.005     Document Type: Article

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