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Volumn , Issue , 2009, Pages 163-164

A wafer-level 3D integration using bottom-up copper electroplating and hybrid metal-adhesive bonding

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ADHESIVE BONDING; ADHESIVE WAFER BONDING; COPPER ELECTROPLATING; HIGH ASPECT RATIO; HYBRID BONDING; POLYMER ADHESIVES; SN BUMPS; THROUGH SILICON VIAS; TWO LAYERS; WAFER-LEVEL 3D INTEGRATION;

EID: 70349469835     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090374     Document Type: Conference Paper
Times cited : (2)

References (15)
  • 1
    • 33947407658 scopus 로고    scopus 로고
    • June
    • R.S. Patti, Proc. IEEE, vol. 94, June 2006, pp. 1214-1224.
    • (2006) Proc. IEEE , vol.94 , pp. 1214-1224
    • Patti, R.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.