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Volumn , Issue , 2009, Pages 163-164
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A wafer-level 3D integration using bottom-up copper electroplating and hybrid metal-adhesive bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D INTEGRATION;
ADHESIVE BONDING;
ADHESIVE WAFER BONDING;
COPPER ELECTROPLATING;
HIGH ASPECT RATIO;
HYBRID BONDING;
POLYMER ADHESIVES;
SN BUMPS;
THROUGH SILICON VIAS;
TWO LAYERS;
WAFER-LEVEL 3D INTEGRATION;
ASPECT RATIO;
COPPER PLATING;
PRESSURE DROP;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
THREE DIMENSIONAL;
TIN;
WAFER BONDING;
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EID: 70349469835
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IITC.2009.5090374 Document Type: Conference Paper |
Times cited : (2)
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References (15)
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