Positive etch profiles in silicon with improved pattern quality

Plasma Processes and Polymers

Volumn 4, Issue SUPPL.1, 2007, Pages

  Richter, Karola ^a   Zschätzsch, Gerd ^a   Bartha, Johann Wolfgang ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Deep plasma silicon etching (DRIE); Microelectromechanical systems (MEMS); Microfabrication; Micropatterning; Positive etch profile; Structure; Surfaces; Varied tilt angle

Indexed keywords

DEEP PLASMA SILICON ETCHING (DRIE); MICROELECTROMECHANICAL SYSTEMS (MEMS); MICROPATTERNING; POSITIVE ETCH PROFILE; STRUCTURE; VARIED TILT ANGLE;

COMPOSITE MICROMECHANICS; MECHATRONICS; MEMS; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; PLASMA ETCHING; PLASMAS;

MICROELECTROMECHANICAL DEVICES;

EID: 70349434881     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200732104     Document Type: Conference Paper

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