Complex micro-patterning in silicon with varied tilt angles realized by advanced plasma etching

Surface and Coatings Technology

Volumn 174-175, Issue , 2003, Pages 845-848

  Richter, K ^a   Fischer, D ^a   Schmidt, D ^a   Bartha, J W ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Advanced Silicon Etch process; Positive Profiles Etching process; Silicon micro patterning

Indexed keywords

PLASMA ETCHING; SURFACE CHEMISTRY;

MICRO-PATTERNING;

SILICON;

COATING; INDUSTRIAL APPLICATION; PLASMA; SURFACE PROPERTY;

EID: 0042328064     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00577-2     Document Type: Article

References (7)

1. Bhardwaj J. Ashraf H. SPIE 2639 1995 224
2. H.V. Boenig, Fundamentals of Plasma Chemistry and Technology, The Research Institute of Plasma Chemistry and Technology, Carlsbad, CA, p. 174
3. Rangelow I.W. Löschner H. J. Vac. Sci. Technol. B 13 6 November/December 1995 2394-2399
4. Aachboun S. Ranson P. J. Vac. Sci. Technol. A 17 4 July/August 1999 2270-2273
5. Richter K. Orfert M. Schührer H. Surf. Coat. Technol. 142-144 2001 797-802
6. Weston D.F. Smekal T. Rhine D.B. Blackwell J. J. Vac. Sci. Technol. B 19 6 November 2001 2846-2851
7. P. Werbaneth, J. Almerico, Solid State Technol., December 2000