Joining of sintered silicon carbide using ternary Ag-Cu-Ti active brazing alloy

Ceramics International

Volumn 35, Issue 8, 2009, Pages 3479-3484

  Liu, Y ^a,b   Huang, Z R ^a   Liu, X J ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

A. Joining; B. Microstructure final; C. Mechanical properties; D. SiC

Indexed keywords

A. JOINING; ACTIVE BRAZING ALLOYS; B. MICROSTRUCTURE-FINAL; BRAZING TEMPERATURE; C. MECHANICAL PROPERTIES; COEFFICIENTS OF THERMAL EXPANSIONS; D. SIC; FILLER ALLOY; FLEXURAL STRENGTH; FOUR-POINT; HIGH TEMPERATURE; HOLDING TIME; INTERFACIAL MICROSTRUCTURE; REACTION LAYERS; ROOM TEMPERATURE; SIC SUBSTRATES; TEM; TEST TEMPERATURES;

BENDING STRENGTH; BRAZING; CERIUM ALLOYS; COPPER ALLOYS; ELECTRON PROBE MICROANALYSIS; FILLERS; JOINING; MICROSTRUCTURE; SILICON ALLOYS; SILICON CARBIDE; SILVER; SILVER ALLOYS; SINTERED CARBIDES; SINTERING; STRESSES; TEMPERATURE INDICATING CAMERAS; THERMAL EXPANSION; TITANIUM ALLOYS; TITANIUM CARBIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

MECHANICAL PROPERTIES;

EID: 70349213757     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2009.03.016     Document Type: Article

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