Microstructure of reactive composite brazing joints of SiC ceramics and Ti alloy by using Ag-Cu-Ti-(Ti + C) as bonding material

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 15, Issue 9, 2005, Pages 1326-1331

  Lin, Guo Biao ^a   Huang, Ji Hua ^a   Zhang, Jian Gang ^a   Liu, Hui Yuan ^a   Mao, Jian Ying ^b   Li, Hai Gang ^b  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b BEIJING INSTITUTE OF SPACECRAFT SYSTEM ENGINEERING   (China)

Author keywords

Bonding; Composite brazing; In situ synthesizing TiC; SiC ceramics; Ti alloy

Indexed keywords

EID: 27244454121     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)