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Volumn 15, Issue SPEC. ISS. 2, 2005, Pages 261-265
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Interfacial reaction and growth behavior of reaction layer of Si 3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
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Author keywords
Cu Zn Ti filler alloy; Interfacial reaction; Kinetic; Si3N4 ceramic
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Indexed keywords
APPARENT ACTIVATION ENERGY;
FILLER ALLOY;
GRAIN SIZE;
GROWTH BEHAVIOR;
INTERFACIAL REACTIONS;
KINETIC EQUATIONS;
REACTION LAYERS;
TIN AND TI;
ACTIVATION ENERGY;
CERAMIC MATERIALS;
CERIUM ALLOYS;
COPPER ALLOYS;
COPPER COMPOUNDS;
CRYSTAL ORIENTATION;
FILLERS;
INTEGRAL EQUATIONS;
SILICON;
TITANIUM ALLOYS;
TITANIUM NITRIDE;
ZINC;
SILICON ALLOYS;
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EID: 63349106104
PISSN: 10036326
EISSN: None
Source Type: Journal
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (14)
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