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Volumn 15, Issue SPEC. ISS. 2, 2005, Pages 261-265

Interfacial reaction and growth behavior of reaction layer of Si 3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy

Author keywords

Cu Zn Ti filler alloy; Interfacial reaction; Kinetic; Si3N4 ceramic

Indexed keywords

APPARENT ACTIVATION ENERGY; FILLER ALLOY; GRAIN SIZE; GROWTH BEHAVIOR; INTERFACIAL REACTIONS; KINETIC EQUATIONS; REACTION LAYERS; TIN AND TI;

EID: 63349106104     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (14)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.