Differentiating the roles of IR measurement and simulation for power and temperature-aware design

ISPASS 2009 - International Symposium on Performance Analysis of Systems and Software

Volumn , Issue , 2009, Pages 1-10

  Huang, Wei ^a   Skadron, Kevin ^a   Gurumurthi, Sudhanva ^a   Ribando, Robert J ^b   Stan, Mircea R ^c  

^a Departments of Computer Science

^b Indiana U Purdue U Indianapolis   (United States)

^c University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR FLOW; BARE DIES; CHIP POWER; CHIP-LEVEL; COOLING SOLUTIONS; DESIGN IMPLICATIONS; DYNAMIC THERMAL MANAGEMENT; HOT SPOT; HOT SPOT IDENTIFICATION; IR CAMERA; IR MEASUREMENTS; OIL FLOW; PACKAGE PINS; RUNTIMES; TEMPERATURE-AWARE DESIGN; THERMAL BEHAVIORS; THERMAL CHARACTERISTICS; THERMAL IMAGING; THERMAL MANAGEMENT; THERMAL MODEL; THERMAL PACKAGE; THERMAL PHENOMENA; THERMAL RESPONSE; THERMAL SENSORS; TRANSIENT RESPONSE; TRANSPARENT LIQUIDS;

COMPUTER SOFTWARE; COOLING; DYNAMIC RESPONSE; HEAT SINKS; TEMPERATURE CONTROL;

DESIGN;

EID: 70349172123     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPASS.2009.4919633     Document Type: Conference Paper

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