Prognostics-based product qualification

IEEE Aerospace Conference Proceedings

Volumn , Issue , 2009, Pages

  Pecht, Michael ^a   Gu, Jie ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVE; PRODUCT QUALIFICATION; QUALIFICATION PROCESS;

EID: 70349127365     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2009.4839686     Document Type: Conference Paper

References (19)

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2. Nvidia graphics chip glitch, http://news.cnet.com/8301-13924-3-10000353- 64.html
3. Pecht, M., Prognostics and Health Management of Electronics, Wiley-Interscience, New York, NY, 2008.
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5. Lau, J.H., Solder Joint Reliability - Theory and Applications, Springer, New York, 1991.
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8. Upadhyayula, K., and Dasgupta, A., "Physics-of-Failure Guidelines for Accelerated Qualification of Electronic Systems," Quality and Reliability Engineering International, Vol. 14 (6), 1998, pp. 433-447.
9. Kwon, D., Azarian, M., and Pecht, M., "Early Detection of Interconnect Degradation Using RF Impedance and SPRT," Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.
10. Wang, W., Azarian, M., and Pecht, M., "Qualification for Product Development", International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, July 2008.
11. Dasgupta, A., and Pecht, M., "Material Failure Mechanisms and Damage Models", IEEE Transactions on Reliability, Vol. 40 (5), 1991, pp. 531-536.
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14. Ganesan, S., and Pecht, M., Lead-free Electronics, 2nd Edition, John Wiley & Sons, Inc., New York, NY, 2006.
15. Pecht, M., Nguyen, L., and Hakim, E., Plastic Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications, John Wiley Publishing Co., New York, NY, 1995.
16. Lall, P., Pecht, M., and Hakim, E., Influence of Temperature on Microelectronics and System Reliability, CRC Press, New York, NY, 1997.
17. Kumar, S., Torres, M., Pecht, M., and Chan, Y.C., "A Hybrid Prognostics Methodology for Electronics Systems," WCCI-IJCNN 2008 Special Session on Computational Intelligence for Anomaly Detection, Diagnosis, and Prognosis, Hong Kong, China.
18. Gu, J., Azarian, M., and Pecht, M., "Failure Prognostics of Multilayer Ceramic Capacitor in Temperature-Humidity-Bias Conditions", International Conference on Prognostics and Health Management, Denver, CO, 2008.
19. IPC-SM-785, "Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments", 1992.