Qualification for product development

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Weiqiang, Wang ^a   Azarian, Michael H ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; FAILURE MODES; INDUSTRIAL ENGINEERING; MACHINE DESIGN; MECHANISMS; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; QUALITY ASSURANCE; QUALITY CONTROL; RELIABILITY ANALYSIS; SAFETY FACTOR; TECHNOLOGY;

APPLICATION REQUIREMENTS; EFFECTS ANALYSIS; ELECTRONIC PACKAGING; FAILURE MECHANISMS; HIGH-DENSITY PACKAGING; INFORMATION COLLECTIONS; INTERNATIONAL CONFERENCES; MATERIAL INFORMATION; PRODUCT CONFIGURATIONS; PRODUCT DEVELOPMENT PROCESS; PRODUCT QUALIFICATIONS; QUALIFICATION TESTING; QUALITY REQUIREMENTS; RELIABILITY ASSESSMENTS; SPECIFIC DESIGN; STRENGTH LIMITS;

RELIABILITY;

EID: 52449098706     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606933     Document Type: Conference Paper

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