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1
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0027632039
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The role of failure mechanism identification in accelerated testing
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J. M. Hu, D. Barker, A. Dasgupta and A. Arora, 'The role of failure mechanism identification in accelerated testing', J. IES, 39-45 (1993).
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J. IES
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Hu, J.M.1
Barker, D.2
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Arora, A.4
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4
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0003682285
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Wiley, New York
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W. Nelson, Accelerated Testing, Statistical Models, Test Plans and Data Analyses, Wiley, New York, 1990.
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Accelerated Testing, Statistical Models, Test Plans and Data Analyses
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Nelson, W.1
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5
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0026374740
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Material Failure Mechanisms and Damage Models - A tutorial series containing 14 articles
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lead article
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A. Dasgupta et al., Material Failure Mechanisms and Damage Models - a tutorial series containing 14 articles in IEEE Trans. Reliab., lead article, REL-40, 531 (1991).
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IEEE Trans. Reliab.
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Dasgupta, A.1
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6
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11744341830
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An integrated physics-of-failure approach to reliability assessment advances in electronic packaging
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P. Lall and M, Pecht, 'An integrated physics-of-failure approach to reliability assessment advances in electronic packaging', ASME EEP, 4(1), 750-755 (1993)
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ASME EEP
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Lall, P.1
Pecht, M.2
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7
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0031146019
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Test philosophies for the new millennium
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T. Larson and J. Newell, 'Test philosophies for the new millennium', J. IES, 22-27 (1997).
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J. IES
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Larson, T.1
Newell, J.2
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8
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0025489039
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The reliability physics approach to failure prediction modeling
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M. Pecht, A. Dasgupta and D. Barker, 'The reliability physics approach to failure prediction modeling', Qual Reliab. Engng. Int., 6, 273-276 (1990).
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Qual Reliab. Engng. Int.
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Pecht, M.1
Dasgupta, A.2
Barker, D.3
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9
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0004175268
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Wiley, New York
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M. Pecht, Integrated Circuit, Hybrid, and Multichip Module Package Design Guideline, Wiley, New York, 1994.
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guideline
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Pecht, M.1
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10
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0029483131
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Physics-of-failure: An approach to reliable product development
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Chicago, IL, August
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M. Pecht and A. Dasgupta, 'Physics-of-failure: an approach to reliable product development', Proc. Institute of Environmental Sciences, Chicago, IL, August 1995, pp. 111-117.
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(1995)
Proc. Institute of Environmental Sciences
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Pecht, M.1
Dasgupta, A.2
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11
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0343851264
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Master's Thesis, Department of Mechanical Engineering, University of Maryland, College Park, MD
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T. Rothman, 'Physics-of-failure methodology for accelerated thermal cycling of LCC solder joints'. Master's Thesis, Department of Mechanical Engineering, University of Maryland, College Park, MD, 1995.
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Physics-of-failure Methodology for Accelerated Thermal Cycling of LCC Solder Joints
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Rothman, T.1
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12
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11744358845
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Accelerated testing of CCAs under combined temperature-vibration loading
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Ottawa, October
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K. Upadhyayula and A. Dasgupta, 'Accelerated testing of CCAs under combined temperature-vibration loading', 2nd Ann. Workshop on Accelerated Stress Testing, IEEE CPMT Society, Ottawa, October 1996, pp. 25-40.
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(1996)
2nd Ann. Workshop on Accelerated Stress Testing, IEEE CPMT Society
, pp. 25-40
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Upadhyayula, K.1
Dasgupta, A.2
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13
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0025448513
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Combined vibrational and thermal solder joint fatigue - A generalized strain versus life approach
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D. B. Barker, J. Vodzak, A. Dasgupta and M. Pecht, 'Combined vibrational and thermal solder joint fatigue - a generalized strain versus life approach', Trans. ASME, J. Electron. Packaging, 112, 129-134 (1990).
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(1990)
Trans. ASME, J. Electron. Packaging
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Barker, D.B.1
Vodzak, J.2
Dasgupta, A.3
Pecht, M.4
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14
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0039105806
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Hidden assumptions in temperature and vibration test time compression models used for durability testing
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H. Caruso, 'Hidden assumptions in temperature and vibration test time compression models used for durability testing', Proc. IES Technical Meet. 1994, pp. 107-115.
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(1994)
Proc. IES Technical Meet.
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Caruso, H.1
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15
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0027887567
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Comparison of electronics-reliability assessment approaches
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M. J. Cushing, D E. Mortin, T. J. Stadterman and A Malhotra, 'Comparison of electronics-reliability assessment approaches', IEEE Trans. Reliab., REL-42, (1993).
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Cushing, M.J.1
Mortin, D.E.2
Stadterman, T.J.3
Malhotra, A.4
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16
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0004171445
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Wiley, New York
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M. Pecht, A. Dasgupta, J. Evans and J. Evans, Quality Conformance and Qualification oj Microelectronic Packages and Interconnects, Wiley, New York, 1994.
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(1994)
Quality Conformance and Qualification Oj Microelectronic Packages and Interconnects
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Pecht, M.1
Dasgupta, A.2
Evans, J.3
Evans, J.4
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17
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85013292283
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Solder creepfatigue analysis by an energy-partitioning approach
-
A. Dasgupta, C. Oyan, D. Barker and M. Pecht, 'Solder creepfatigue analysis by an energy-partitioning approach', ASME Trans. Electron Packaging, 144, 152-160 (1992).
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(1992)
ASME Trans. Electron Packaging
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Dasgupta, A.1
Oyan, C.2
Barker, D.3
Pecht, M.4
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19
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0029309215
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An accelerated life test model based on reliability kinetics
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W. Q. Meeker and M. J. LuValle, 'An accelerated life test model based on reliability kinetics', Technometrics, 37, 133-146 (1995).
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Technometrics
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Meeker, W.Q.1
LuValle, M.J.2
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20
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0031650797
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A fundamental overview of analytical accelerated testing models
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H. Caruso and A. Dasgupta, 'A fundamental overview of analytical accelerated testing models', J. IES, 41(1), 16-30 (1998).
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(1998)
J. IES
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, Issue.1
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Caruso, H.1
Dasgupta, A.2
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21
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0030314495
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Characterizing the commercial avionics thermal environment for field reliability assessment
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K. J. Cluff, D. Barker, D. Robbins and T. Edwards, 'Characterizing the commercial avionics thermal environment for field reliability assessment', Proc. IES Technical Meet., 1996, pp. 50-57.
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Proc. IES Technical Meet.
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Cluff, K.J.1
Barker, D.2
Robbins, D.3
Edwards, T.4
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22
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85081462071
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Boeing Commercial Airplane Group, personal communication, July
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W. Viebrock and E. Minor, Boeing Commercial Airplane Group, personal communication, July 1997.
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(1997)
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Viebrock, W.1
Minor, E.2
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23
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0031334247
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An incremental damage super-position approach for reliability of electronic interconnects under combined accelerated stresses
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Dallas, TX, November
-
K. Upadhyayula and A. Dasgupta, 'An incremental damage super-position approach for reliability of electronic interconnects under combined accelerated stresses', 9th Symp. on Mechanics of Surface Mount Assembly, Dallas, TX, November 1997
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(1997)
9th Symp. on Mechanics of Surface Mount Assembly
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Upadhyayula, K.1
Dasgupta, A.2
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24
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85115243338
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Cumulative damage in fatigue
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M. A. Miner, 'Cumulative damage in fatigue', J. Appl. Mech., 67, A159-A164 (1945).
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Miner, M.A.1
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25
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11744282184
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Applications of wavelets for cost-effective vibration response of electronic circuit card assemblies
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P Dujari, K. Upadhyayula, A. Dasgupta and B. Balachandran, 'Applications of wavelets for cost-effective vibration response of electronic circuit card assemblies', Experimental/Numerical Mechanics in Electronic Packaging, Society of Experimental Mechanics, Spring Conf, 1997, pp. 67-75.
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(1997)
Experimental/Numerical Mechanics in Electronic Packaging, Society of Experimental Mechanics, Spring Conf
, pp. 67-75
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Dujari, P.1
Upadhyayula, K.2
Dasgupta, A.3
Balachandran, B.4
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