A wet-etch method with improved yield for realizing polysilicon resistors in batch fabrication of MEMS pressure sensor

Sensor Review

Volumn 29, Issue 3, 2009, Pages 260-265

  Singh, Kulwant ^a,b,c   Gupta, Sanjeev K ^a,b,d   Azam, Amir ^d   Akhtar, J ^a  

^a CENTRAL ELECTRONICS ENGINEERING RESEARCH INSTITUTE   (India)

^b NATIONAL CHEMICAL LABORATORY   (India)

^c TEZPUR UNIVERSITY   (India)

^d ALIGARH MUSLIM UNIVERSITY   (India)

Author keywords

Batch manufacturing; Films (states of matter); Resistors; Silicon

Indexed keywords

BATCH FABRICATION; BATCH MANUFACTURING; BATCH PRODUCTION; BORON-DOPED; BULK-MICROMACHINED; CHEMICAL VAPOUR DEPOSITION; CHIP AREAS; CONVENTIONAL APPROACH; DESIGN/METHODOLOGY/APPROACH; DISCRETIZATIONS; FABRICATION PROCESS; FILMS (STATES OF MATTER); MEMS PRESSURE SENSOR; METAL LINE; PIEZO-RESISTORS; POLYSILICON FILMS; POLYSILICON RESISTORS; PROCESS STEPS; REACTIVE ION; REPRODUCIBILITIES; SELECTIVE ETCHING; SELECTIVE WET ETCHING; WET-ETCH;

BORON; ELECTRONIC STRUCTURE; FABRICATION; MICROELECTRONICS; POLYSILICON; RESISTORS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WET ETCHING;

REACTIVE ION ETCHING;

EID: 70149114472     PISSN: 02602288     EISSN: None     Source Type: Journal    
DOI: 10.1108/02602280910967675     Document Type: Article

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