A process to control diaphragm thickness with a provision for back to front alignment in the fabrication of polysilicon piezoresistive pressure sensor

Sensor Review

Volumn 23, Issue 4, 2003, Pages 311-315

  Akhtar, J ^a   Dixit, B B ^a   Pant, B D ^a   Deshwal, V P ^a   Joshi, B C ^a  

^a CENTRAL ELECTRONICS ENGINEERING RESEARCH INSTITUTE   (India)

Author keywords

Batch manufacturing; Microsensors; Sensors

Indexed keywords

COST EFFECTIVENESS; DIAPHRAGMS; PIEZOELECTRIC DEVICES; POLYSILICON; PROCESS CONTROL; SENSORS;

PRESSURE SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0242270534     PISSN: 02602288     EISSN: None     Source Type: Journal    
DOI: 10.1108/02602280310496827     Document Type: Article

References (8)

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