Reticle inspection-based critical dimension uniformity

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7379, Issue , 2009, Pages

  Vellanki, Venu ^a   Hess, Carl ^a   Pan, Gang ^a   Chen, Chunlin ^a   Inderhees, Gregg ^a   Lopez, Daniel ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

5xx; CDU; Critical Dimension Uniformity; High Resolution; Reticle Inspection; TeraScan

Indexed keywords

5XX; CDU; CRITICAL DIMENSION UNIFORMITY; HIGH RESOLUTION; RETICLE INSPECTION; TERASCAN;

DATA ACQUISITION; DATA STORAGE EQUIPMENT; INDUSTRIAL ENGINEERING; INSPECTION; INSPECTION EQUIPMENT; MANUFACTURE; MASKS; PHOTOMASKS; PRODUCTION ENGINEERING;

OPTICAL INSTRUMENTS;

EID: 69949173542     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.824319     Document Type: Conference Paper

References (5)

1. International Technology Roadmap for Semiconductors, Lithography (2008)
2. Chen, C.J., et al., "Global CD Uniformity Improvement Using Dose Modulation and Pattern Correction of Pattern Density-Dependent and Position-Dependent Errors, " Proc. SPIE 5446, (2004)
3. Dayal, A., et al., "Results from the KLA-Tencor TeraScanXR reticle inspection tool, " Proc. SPIE 7122, (2008)
4. KLA-Tencor LMW9045 - Advanced Mask CD SEM Metrology System Product Specification
5. Van der Laana, H., et al., "Etch, Reticle, and Track CD Fingerprint Corrections with Local Dose Compensation, " Proc. SPIE 5755, (2005)