Results from the KLA-tencor TeraScanXR reticle inspection tool

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7122, Issue , 2008, Pages

  Dayal, Aditya ^a   Mu, Bo ^a   Iyer, Venkat ^a   Lim, Phillip ^a   Goonesekera, Arosha ^a   Broadbent, Bill ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

Defects; Inspection; Line edge roughness; Photomask; TeraScan

Indexed keywords

AUTO FOCUS; DEFECT SENSITIVITIES; IMAGE PROCESSING COMPUTERS; KEY FEATURES; KLA-TENCOR; LINE EDGE ROUGHNESS; MEMORY TECHNOLOGIES; PRELIMINARY DATUM; RETICLE INSPECTIONS; TERASCAN;

DEFECTS; DIES; IMAGE QUALITY; INSPECTION; INSPECTION EQUIPMENT; OPTICAL DATA PROCESSING; OPTICAL INSTRUMENTS; PHOTOMASKS; ROUGHNESS MEASUREMENT;

EDGE DETECTION;

EID: 62649142256     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.801831     Document Type: Conference Paper

References (5)

1. International Technology Roadmap for Semiconductors, 2007.
2. Tanabe, H. et al., "LER Transfer from a Mask to Wafers", Photomask and Next-Generation Lithography Mask Technology XIV, Proc SPIE vol. 6607 (2007)
3. A. Dayal, J-P. Sier, et al., "Optimized inspection of advance reticles on the TeraScan reticle inspection tool", 25th Annual BACUS Symposium on Photomask Technology, Proc SPIE, vol. 5992, 599245 (2005).
4. Broadbent et al., "Results from a new Die-to-Database reticle inspection platform", Photomask and NGL Mask Technology XI, Proc SPIE Vol. 5446 (2004)
5. Stokowski, S. & Alles, D., "Measuring line-edge roughness of masks with DUV light", 25th Annual BACUS Symposium on Photomask Technology, Proc SPIE, vol. 5992, 599245 (2005).