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Volumn 7298, Issue , 2009, Pages

Vacuum packaging technology for mass production of uncooled IRFPAs

Author keywords

MEMS; Micro vacuum gauge; Uncooled infrared focal plane array; Vacuum packaging

Indexed keywords

AIR MOLECULES; BATCH SIZES; FABRICATION PROCESS; HIGH-VACUUM CONDITIONS; MASS PRODUCTION; MICRO-VACUUM GAUGE; OPERATION PRINCIPLES; THERMAL CONDUCTION; UNCOOLED; UNCOOLED INFRARED FOCAL PLANE ARRAY; UNIFORM HEATING; VACUUM GAUGES; VACUUM LEVEL; VACUUM PACKAGING;

EID: 69949163718     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.822707     Document Type: Conference Paper
Times cited : (8)

References (7)
  • 1
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    • Unewisse, M.H.1
  • 2
    • 0036907264 scopus 로고    scopus 로고
    • Thin-film ferroelectric: Breakthrough
    • Hanson, C. M. and Beratan H. R., "Thin-film ferroelectric: breakthrough, " Proc. SPIE, 4721, 91-99 (2002).
    • (2002) Proc. SPIE , vol.4721 , pp. 91-99
    • Hanson, C.M.1    Beratan, H.R.2
  • 3
    • 0032632172 scopus 로고    scopus 로고
    • Advances in amorphous silicon uncooled IR systems
    • Brady, J., et al., "Advances in amorphous silicon uncooled IR systems, " Proc. SPIE, 3698, 161-167 (1999).
    • (1999) Proc. SPIE , vol.3698 , pp. 161-167
    • Brady, J.1
  • 4
    • 4344698979 scopus 로고    scopus 로고
    • Infrared microbolometer sensors and their application in automotive safety
    • Yon, J. J., et al., "Infrared microbolometer sensors and their application in automotive safety, " Proc. AMAA 2003 Conference, 137-157 (2003).
    • (2003) Proc. AMAA 2003 Conference , pp. 137-157
    • Yon, J.J.1
  • 5
    • 10044237909 scopus 로고    scopus 로고
    • Advanced packaging development for very low cost uncooled IRFPA
    • Astier, A. et al., "Advanced packaging development for very low cost uncooled IRFPA, " Proc. SPIE, 5406, 412-421 (2004).
    • (2004) Proc. SPIE , vol.5406 , pp. 412-421
    • Astier, A.1
  • 6
    • 33747678708 scopus 로고    scopus 로고
    • Uncooled IRFPA with chip scale vacuum package
    • Hata, H., et al., "Uncooled IRFPA with chip scale vacuum package, " Proc. SPIE, 6206, 620612-1-620619-10 (2006).
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    • Hata, H.1
  • 7
    • 45549101974 scopus 로고    scopus 로고
    • Innovative on-chip packaging applied to uncooled IRFPA
    • Dumont, G., et al., "Innovative on-chip packaging applied to uncooled IRFPA, " Proc. SPIE, 6940, 69401Y-1-69401Y-6 (2008).
    • (2008) Proc. SPIE , vol.6940
    • Dumont, G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.