Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008

Volumn , Issue , 2008, Pages

  Han, Ki Jin ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 69649105502     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APMC.2008.4958466     Document Type: Conference Paper

References (5)

1. K.J. Han, M. Swaminathan, and E. Engin, "Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects," in Proc. 45th ACM/IEEE Design Automation Conference (DAC), pp. 421-424, Jun. 2008.
2. A. Ruehli, "Equivalent Circuit Models for Three-Dimensional Multiconductor Systems," IEEE Trans. Microwave Theory and Techniques, vol.22, pp. 216-221, Mar. 1974.
3. L. Daniel, A. Sangiovanni-Vincentelli, and J. White, "Using conduction modes basis functions for efficient electromagnetic analysis of on-chip and off-chip interconnect," in Proc. 38th ACM/IEEE Design Automation Conference (DAC), pp. 563-566, Jun. 2001.
4. J.B. Faria and M.G. das Neves, "Accurate evaluation of indoor triplex cable capacitances taking conductor proximity effects into account," IEEE Trans. Power Delivery, vol.21, pp. 1238-1244, Jul. 2006. (Pubitemid 43983646)
5. C. Schuster, G. Leonhardt, and W. Fichtner, "Electromagnetic simulation of bonding wires and comparison with wide band measurements," IEEE Trans. Advanced Packaging, vol.23, pp. 69-79, Feb. 2000. (Pubitemid 30583963)