Thermal analysis of selected tin-based lead-free solder alloys

Kovove Materialy

Volumn 47, Issue 1, 2009, Pages 43-50

  Palcut, M ^a,c   Sopousek J ^b   Trnkova L ^a   Hodulova E ^a   Szewczykova B ^a   Ozvold M ^a   Turna M ^a   Janovec, J ^a  

^a SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

^b MASARYK UNIVERSITY   (Czech Republic)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

CALPHAD; DSC; Lead free solders; Phase equilibria

Indexed keywords

EID: 69549092289     PISSN: 0023432X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

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