Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials

Archives of Metallurgy and Materials

Volumn 50, Issue 4, 2005, Pages 1065-1071

  Kisiel, R ^a   Gasior W ^b   Moser, Z ^b   Pstrus J ^b   Bukat, K ^c   Sitek, J ^c  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^c TELE AND RADIO RESEARCH INSTITUTE   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33746091280     PISSN: 08607052     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies Journal of Phase Equilibria and Diffusion 25 2, 122-4 (2004).
2. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology, Electrochemical Publications Ltd, 2001, Chapter 10, 252-265 (2001).
3. National Institute of Standards and Technology & Colorado School of Mines, Database for Solder Properties with Emphasis on New Lead-Free Solders, Colorado, February 11, 2002.
4. B.A. Cook, I.E. Anderson, J.L. Harringa, R.L. Terpstra, J. Electronic Materials 31, 1190-1194 (2002).