Power module design without solder interfaces-An ideal solution for hybrid vehicle traction applications

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2009, Pages 472-478

  Scheuermann, U ^a  

^a Research Development Modules and Chips Semikron Elektronik GmbH Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BASE PLATES; HIGH RELIABILITY; HYBRID VEHICLES; IDEAL SOLUTIONS; MODULE ARCHITECTURE; MODULE DESIGN; POWER CYCLE; POWER MODULE; SOLDER INTERFACES; TEMPERATURE CYCLES; THERMAL CYCLE; TRACTION SYSTEMS;

AUTOMOBILE ELECTRONIC EQUIPMENT; BRAZING; DESIGN; HYBRID SYSTEMS; LAND VEHICLE PROPULSION; MOTION CONTROL; POWER ELECTRONICS; TRACTION (FRICTION); VEHICLES; WELDING;

AUTOMOBILE PARTS AND EQUIPMENT;

EID: 65949122538     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2009.4802700     Document Type: Conference Paper

References (10)

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