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Volumn 13, Issue 3, 2009, Pages 135-150

Hybrid solid state/fluidic cooling for hot spot removal

Author keywords

Hot spot; Microchannel heat sink; Phase change; Single phase convection; Solid state

Indexed keywords

COOLING SCHEME; HOT SPOT; HYBRID SOLIDS; MICROCHANNEL HEAT SINK; PHASE CHANGE; SINGLE-PHASE CONVECTION; ULTRA-HIGH;

EID: 68949128632     PISSN: 15567265     EISSN: None     Source Type: Journal    
DOI: 10.1080/15567260903058033     Document Type: Article
Times cited : (24)

References (15)
  • 1
    • 8744275027 scopus 로고    scopus 로고
    • 2007 Edition. Available at, accessed January 2008
    • International Technology Roadmap for Semiconductors, Executive Summary 2007 Edition. Available at http://www.itrs.net (accessed January 2008).
    • Executive Summary
  • 3
    • 4444250063 scopus 로고    scopus 로고
    • Thermal Implications of Non-Uniform Die Power Map and CPU Performance
    • Maui, HI
    • A. Watwe and R. Viswanath, Thermal Implications of Non-Uniform Die Power Map and CPU Performance, in Proceedings of Interpack'03 Maui, HI, 2003, p. 35044.
    • (2003) Proceedings of Interpack'03 , pp. 35044
    • Watwe, A.1    Viswanath, R.2
  • 5
    • 0000886827 scopus 로고    scopus 로고
    • Heterostructure Integrated Thermionic Coolers
    • A. Shakouri and J. E. Bowers, Heterostructure Integrated Thermionic Coolers, Applied Physics Letters, vol. 71, pp. 1234-6, 1997.
    • (1997) Applied Physics Letters , vol.71 , pp. 1234-1236
    • Shakouri, A.1    Bowers, J.E.2
  • 6
    • 32844465704 scopus 로고    scopus 로고
    • Y. Zhang, C. Hoffman, P. Wang, G. Zeng, A. Shakouri, and A. Bar-Cohen, Experimental Characterization of Bonded Microcoolers for Hot Spot Removal, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v PART C, San Francisco, CA, United States, 2006, pp. 2185-2193.
    • Y. Zhang, C. Hoffman, P. Wang, G. Zeng, A. Shakouri, and A. Bar-Cohen, Experimental Characterization of Bonded Microcoolers for Hot Spot Removal, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v PART C, San Francisco, CA, United States, 2006, pp. 2185-2193.
  • 14
    • 1142304498 scopus 로고    scopus 로고
    • Electronic and Thermoelectric Transport in Semiconductor and Metallic Superlattices
    • D. Vashaee and A. Shakouri, Electronic and Thermoelectric Transport in Semiconductor and Metallic Superlattices, Journal of Applied Physics, vol. 95, pp. 1233-1245, 2004.
    • (2004) Journal of Applied Physics , vol.95 , pp. 1233-1245
    • Vashaee, D.1    Shakouri, A.2
  • 15
    • 0141495195 scopus 로고    scopus 로고
    • Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels. Transactions of the ASME
    • Y.S. Muzychka, J.R. Culham, and M.M. Yovanovich, Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels. Transactions of the ASME. Journal of Electronic Packaging, vol. 125, pp. 178-185, 2003.
    • (2003) Journal of Electronic Packaging , vol.125 , pp. 178-185
    • Muzychka, Y.S.1    Culham, J.R.2    Yovanovich, M.M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.