Superhydrophobic Coatings for Microdevices

Journal of Adhesion Science and Technology

Volumn 22, Issue 15, 2008, Pages 1883-1891

  Shiu, Jau Ye ^a   Whang, Wha Tzong ^a   Chen, Peilin ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b RESEARCH CENTER FOR APPLIED SCIENCES   (Taiwan)

Author keywords

Coating; Nanoimprint; Nanosphere lithography; Superhydrophobic

Indexed keywords

DEVICE SURFACES; DRY ETCHING PROCESS; FEATURE SIZES; FLUOROPOLYMER; HYDROPHOBIC COATINGS; METAL DEPOSITION; MICRO DEVICES; NANOIMPRINT; NANOIMPRINT PROCESS; NANOIMPRINT STAMPS; NANOPARTICLE ARRAY; NANOSPHERE LITHOGRAPHY; OXYGEN PLASMA TREATMENTS; OXYGEN PLASMAS; SILICON STAMP; SILICON SURFACES; SUPERHYDROPHOBIC; SUPERHYDROPHOBIC COATINGS; WATER CONTACT ANGLE;

COATINGS; CONTACT ANGLE; HYDROPHOBICITY; MONOLAYERS; NANOSPHERES; OXYGEN; PHOTORESISTS; PLASMA DEPOSITION; PLASMA ETCHING; PLASMAS; PORTABLE EQUIPMENT; WATER TREATMENT;

NANOIMPRINT LITHOGRAPHY;

EID: 68949101946     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X320032     Document Type: Article

References (27)

1. M. Morra, E. Occhiello and F. Garbassi, Langmuir 5, 872 (1989).
2. J. P. Youngblood and T. J. McCarthy, Macromolecules 32, 6800 (1999).
3. C. Neinhuis and W. Barthlott, Annals of Botany 79, 667 (1997).
4. W. Barthlott and C. Neinhuis, Planta 202, 1 (1997).
5. A. Nakajima, A. Fujishima, K. Hashimoto and T. Watanabe, Adv. Mater. 11, 1365 (1999).
6. N. A. Patankar, Langmuir 19, 1249 (2003).
7. T. L. Sun, H. Tan, D. Han and Q. Fu, L. Jiang, Small 1, 959 (2005).
8. L. Feng, S. H. Li, Y. S. Li, H. J. Li, L. J. Zhang, J. Zhai, Y. L. Song, B. Liu, L. Jiang and D. B. Zhu, Adv. Mater. 14, 1857 (2002).
9. Z. Z. Gu, H. Uetsuka, K. Takahashi, R. Nakajima, H. Onishi, A. Fujishima and O. Sato, Angew. Chem Intl. Ed. 42, 894 (2003).
10. D. O. H. Teare, C. G. Spanos, P. Ridley, E. J. Kinmond, V. Roucoules, J. P. S. Badyal, S. A. Brewer, S. Coulson and C. Willis, Chem. Mater. 14, 4566 (2002).
11. K. Tsujii, T. Yamamoto, T. Onda and S. Shibuichi, Angew. Chem. Intl. Ed. 36, 1011 (1997).
12. H. Y. Erbil, A. L. Demirel, Y. Avci, Y. Avc and O. Mert, Science 299, 1377 (2003).
13. I. Woodward, W. C. E. Schofield, V. Roucoules and J. P. S. Badyal, Langmuir 19, 3432 (2003).
14. M. Morra, E. Occhiello and F. Garbassi, J. Colloid Interface Sci. 132, 504 (1989).
15. H. J. Li, X. B. Wang, Y. L. Song, Y. Q. Liu, Q. S. Li, L. Jiang and D. B. Zhu, Angew. Chem. Intl. Ed. 40, 1743 (2001).
16. L. Feng, S. H. Li, H. J. Li, J. Zhai, Y. L. Song, L. Jiang and D. B. Zhu, Angew. Chem. Intl. Ed. 41, 1221 (2002).
17. S. Shibuichi, T. Onda, N. Satoh and K. Tsujii, J. Phys. Chem. 100, 19512 (1996).
18. J. Bico, C. Marzolin and D. Quere, Europhys. Letters 47, 743 (1999).
19. F. Walther, P. Davydovskaya, S. Zurcher, M. Kaiser, H. Herberg, A. M. Gigler and R. W. Stark, J. Micromech. Microeng. 17, 524 (2007).
20. J. Chauvin, T. Kawai and M. Irie, Jap. J. Appl. Phys. Part 1 40, 2518 (2001).
21. J. Y. Shiu and P. L. Chen, Adv. Mater. 17, 1866 (2005).
22. J. Y. Shiu, C. W. Kuo and P. L. Chen, J. Amer. Chem. Soc. 126, 8096 (2004).
23. J. Y. Shiu and P. L. Chen, Adv. Functional Mater. 17, 2680 (2007).
24. C. W. Kuo, J. Y. Shiu, P. L. Chen and G. A. Somorjai, J. Phys. Chem. B 107, 9950 (2003).
25. C. W. Kuo, J. Y. Shiu and P. L. Chen, Chem. Mater. 15, 2917 (2003).
26. C. W. Kuo, J. Y. Shiu, Y. H. Cho and P. L. Chen, Adv. Mater. 15, 1065 (2003).
27. J. Y. Shiu, C. W. Kuo, P. L. Chen and C. Y. Mou, Chem. Mater. 16, 561 (2004).