SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 2006-2012

Femtosecond laser drilling of alumina wafers

(3) Li, Chengde a Lee, Seongkuk b Nikumb, Suwas b

a BEIJING INSTITUTE OF TECHNOLOGY (China)

b NATIONAL RESEARCH COUNCIL CANADA (Canada)

Author keywords

Alumina (Al 2O 3); Femtosecond laser; Via hole drilling

Indexed keywords

ABLATION PLUMES; ABLATION RATES; CHEMICAL COMPOSITIONS; ENERGY DISPERSIONS; FEMTOSECOND LASER; FREE OF CRACKS; HOLE DRILLING; HOLE DRILLING TECHNIQUE; NANOSECOND LASER ABLATION; NEAR INFRARED FEMTOSECOND LASER; RESOLIDIFICATION; ULTRA FINE POWDER; ULTRASONIC BATH; VIA HOLE; VIA-HOLE DRILLING;

ACETONE; ALUMINUM; DRILLING PLATFORMS; LASER ABLATION; LASERS; METAL MELTING; MOLTEN MATERIALS; OPTICAL MICROSCOPY; PULSED LASER APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SLAGS; ULTRASHORT PULSES;

DRILLING;

EID: 68949101243 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0811-6 Document Type: Article

Times cited : (26)

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