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Volumn 32, Issue 2, 2009, Pages 347-357

A thermal-hydraulic comparison of liquid, microchannel and impinging liquid jet array heat sinks for high-power electronics cooling

Author keywords

Impinging jet cooling; Liquid cooling; Micro channel cooling

Indexed keywords

A-THERMAL; ELECTRONIC DEVICE; HIGH POWER ELECTRONICS; HIGH PRESSURE; IMPINGING JET; IMPINGING JET COOLING; LIQUID COOLING; LIQUID JETS; LOWER PRESSURES; MASS FLOW RATE; MICRO CHANNEL COOLING; MICRO CHANNEL HEAT SINKS; OPERATING PRESSURE; PUMPING POWER; SINGLE-PHASE LIQUIDS; TEMPERATURE UNIFORMITY; THERMAL MANAGEMENT; VOLUMETRIC FLOW RATE;

EID: 68349137385     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2010408     Document Type: Article
Times cited : (73)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.