Thermal challenges in 3-D stacked packaging

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 1-

  Natarajan, Venkat ^a  

^a INTEL TECHNOLOGY INDIA PVT LTD   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; HEAT EXCHANGERS; HEAT TRANSFER; HEATING EQUIPMENT; TECHNOLOGY; TECHNOLOGY TRANSFER; THERMOANALYSIS;

3-D PACKAGING; COMPUTING PLATFORMS; EMERGING TRENDS; FORM FACTORS; RAPID DEVELOPMENT; STACKED PACKAGING; SYSTEM LEVELS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 48049121988     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451736     Document Type: Conference Paper

References (0)