Development of precision transfer technology of atmospheric hot embossing by ultrasonic vibration

Microsystem Technologies

Volumn 13, Issue 3-4, 2007, Pages 385-391

  Mekaru, Harutaka ^a   Nakamura, Osamu ^b   Maruyama, Osamu ^b   Maeda, Ryutaro ^a   Hattori, Tadashi ^c  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Engineering System Co Ltd   (Japan)

^c UNIVERSITY OF HYOGO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERICS; GLASS TRANSITION; MOLDS; ULTRASONICS;

CONTACT FORCE; HOT EMBOSSING; PRECISION TRANSFER TECHNOLOGY; ULTRASONIC VIBRATION;

TECHNOLOGY TRANSFER;

EID: 33845732271     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0203-2     Document Type: Article

References (7)

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2. Chou S Y, Krauss PR, Renstrom PJ (1995) Imprint of sub-25 nm vias and trenches in polymers. Appl Phys Lett 67:3114
3. Heckele M, Bacher W, Müller KD (1998) Hot embossing-the molding technique for plastic microstructures. Microsystem Technol 4:122-124
4. Heckele M, Dittrich H, Guber A, Schaller T (2001) Double-side hot embossing of microstructures. HARMST'01, Book of abstract pp 137-138
5. Mekaru H, Yamada T, Yan S, Hattori T (2004) Microfabrication by hot embossing and injection molding at LASTI. Microsystem Technol 10:682-688
6. Roos N, Wissen M, Scheer H, Glinsner T (2003) Impact of vacuum environment on the hot embossing process. SPIE's microlithography pp 22-28
7. Yamada T, Mekaru H, Ishigaki H, Hattori T, Kitazima A, Maeda R (2002) Microfabrication of polymer microstructure using hot embossing. In: Proceedings of JSME/ASME international conference on materials and processing 2002 2:597-600