Ultrasonic micro hot embossing of polymers exemplified by a micro thermal flow sensor

Smart Systems Integration 2008 - 2nd European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2008

Volumn , Issue , 2008, Pages

  Khuntontong, Puttachat ^a   Blaser, Thomas ^b   Schomburg, Werner Karl ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b RINCO Ultrasonics AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; INTEGRATION; MICROMACHINING; MICROSTRUCTURE; NETWORK COMPONENTS; POLYMER FILMS; POLYPROPYLENES; SEMICONDUCTING FILMS;

FABRICATION PROCESS; FEATURE SIZES; FLOW-SENSORS; HOT-EMBOSSING; INVESTMENT COSTS; MICRO HOT EMBOSSING; MICROPATTERNED; THERMAL FLOW SENSOR;

MOEMS;

EID: 85060962380     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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