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The post array was molded from a photoresist mold (Shipley S1818) patterned by photolithography. To assemble the chips, we spin-coated a #1 coverslip with a thin film of PDMS and bonded it to the replica-molded PDMS post array after exposing both substrates to an oxygen plasma. A 1″ × 3″ microscope slide with large cylindrical reservoirs (ID=7 mm) was bonded to the back side of the chip for reinforcement and to suppress hydrodynamic flow. The completed and sealed chips were filled with TBE 2.2× buffer and submerged in buffer for 48 h at 55°C, a modification of an existing protocol for preventing pervaporation. To perform replica experiments, the chips were regenerated by emptying them, refilling with neat buffer, and then soaking again in buffer at 55°C.
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The post array was molded from a photoresist mold (Shipley S1818) patterned by photolithography. To assemble the chips, we spin-coated a #1 coverslip with a thin film of PDMS and bonded it to the replica-molded PDMS post array after exposing both substrates to an oxygen plasma. A 1″ × 3″ microscope slide with large cylindrical reservoirs (ID=7 mm) was bonded to the back side of the chip for reinforcement and to suppress hydrodynamic flow. The completed and sealed chips were filled with TBE 2.2× buffer and submerged in buffer for 48 h at 55°C, a modification of an existing protocol for preventing pervaporation. To perform replica experiments, the chips were regenerated by emptying them, refilling with neat buffer, and then soaking again in buffer at 55°C.
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The electric field in the separation arm was computed from the applied potentials using Kirchoff's laws and assuming a uniform resistivity.
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The electric field in the separation arm was computed from the applied potentials using Kirchoff's laws and assuming a uniform resistivity.
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Our measurement of μ0 =1.8× 10-4 cm2 /Vs agrees well with previous measurements in PDMS devices.
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Our measurement of μ0 =1.8× 10-4 cm2 /Vs agrees well with previous measurements in PDMS devices.
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