Formation and assembly of carbon nanotube bumps for interconnection applications

Diamond and Related Materials

Volumn 18, Issue 9, 2009, Pages 1109-1113

  Yung, K P ^a,b   Wei, J ^a   Tay, B K ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Carbon Nanotubes; Flip Chip; Interconnects; Joining

Indexed keywords

ASSEMBLY PROCESS; ELECTRICAL CONDUCTIVITY; ELECTRICAL PROPERTY; FLIP CHIP; FLIP CHIP BONDING; FLIP CHIP INTERCONNECTS; HIGH DENSITY; INTERCONNECTS;

ELECTRIC CONDUCTIVITY; JOINING; SILVER; SUBSTRATES; VAN DER WAALS FORCES;

CARBON NANOTUBES;

EID: 67649657717     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2009.02.022     Document Type: Article

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