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Volumn 43, Issue 4, 2007, Pages 508-515

Carbon nanotube bumps for thermal and electric conduction in transistor

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBE BUMPS; SEMICONDUCTOR CHIPS;

EID: 36049004946     PISSN: 00162523     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (13)

References (8)
  • 1
    • 36048979438 scopus 로고    scopus 로고
    • Electron device applications of carbon nanotubes. (in Japanese)
    • Y. Awano: Electron device applications of carbon nanotubes. (in Japanese), OYO BUTURI, 73, 9, p.1212-1215 (2004).
    • (2004) OYO BUTURI , vol.73 , Issue.9 , pp. 1212-1215
    • Awano, Y.1
  • 2
    • 36048962237 scopus 로고    scopus 로고
    • Carbon Nanotubes: From Growth, Placement and Assembly Control to 60 mV/decade and Sub-60 mV/decade Tunnel Transistors
    • Digest, p
    • H. Dai et al.: Carbon Nanotubes: From Growth, Placement and Assembly Control to 60 mV/decade and Sub-60 mV/decade Tunnel Transistors. IEEE 2006 IEDM Tech. Digest, p.431-434.
    • IEEE 2006 IEDM Tech , pp. 431-434
    • Dai, H.1
  • 3
    • 46049094020 scopus 로고    scopus 로고
    • First Demonstration of AC Gain From a Single-walled Carbon Nanotubes Common-Source Amplifier
    • Digest, p
    • I. Amlani et al.: First Demonstration of AC Gain From a Single-walled Carbon Nanotubes Common-Source Amplifier. IEEE 2006 IEDM Tech. Digest, p.559-562.
    • IEEE 2006 IEDM Tech , pp. 559-562
    • Amlani, I.1
  • 4
    • 28244463477 scopus 로고    scopus 로고
    • Low-resistance Multi-walled Carbon Nanotube Vias with Parallel Channel Conduction of Inner Shells
    • Digest, p
    • M. Nihei et al.: Low-resistance Multi-walled Carbon Nanotube Vias with Parallel Channel Conduction of Inner Shells. IEEE 2005 IITC Tech. Digest, p.234-236.
    • IEEE 2005 IITC Tech , pp. 234-236
    • Nihei, M.1
  • 5
    • 3142647341 scopus 로고    scopus 로고
    • Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects
    • M. Nihei et al.: Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects. Jpn. J. Appl. Phys, 43, p. 1856-1859 (2004).
    • (2004) Jpn. J. Appl. Phys , vol.43 , pp. 1856-1859
    • Nihei, M.1
  • 6
    • 36349032609 scopus 로고    scopus 로고
    • Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles
    • Digest, p
    • S. Sato et al.: Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles. IEEE 2006 IITC Tech. Digest, p.230-232.
    • IEEE 2006 IITC Tech , pp. 230-232
    • Sato, S.1
  • 7
    • 34748820359 scopus 로고    scopus 로고
    • T. Kikkawa et al.: Recent Progress of Highly Reliable GaN-HEMT for Mass Production. CS MANTECH Digest, p.171-174 (2006).
    • T. Kikkawa et al.: Recent Progress of Highly Reliable GaN-HEMT for Mass Production. CS MANTECH Digest, p.171-174 (2006).
  • 8
    • 33847710695 scopus 로고    scopus 로고
    • Thermal and Source Bumps utilizing Carbon Nanotubes for Flip-chip High Power Amplifiers
    • Digest, p
    • T. Iwai et al.: Thermal and Source Bumps utilizing Carbon Nanotubes for Flip-chip High Power Amplifiers. IEEE 2005 IEDM Tech. Digest, p.265-268.
    • IEEE 2005 IEDM Tech , pp. 265-268
    • Iwai, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.