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Volumn 12, Issue 5, 2003, Pages 26-28
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Wafer bumping for flip chip attach
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Author keywords
[No Author keywords available]
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Indexed keywords
COSTS;
FLIP CHIP DEVICES;
GOLD;
SOLDERING ALLOYS;
WAFER BUMPING;
ELECTRONICS PACKAGING;
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EID: 0038658899
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Review |
Times cited : (1)
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References (0)
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