Analyses of crack growth along interface of patterned wafer-level Cu-Cu bonds

International Journal of Solids and Structures

Volumn 46, Issue 18-19, 2009, Pages 3433-3440

  Tvergaard, Viggo ^a   Hutchinson, John W ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b HARVARD UNIVERSITY   (United States)

Author keywords

Crack growth; Finite strains; Interface toughness; Plasticity; Thin films

Indexed keywords

COHESIVE ZONES; COMPUTATIONAL MODEL; CRACK ADVANCE; CRACK FRONTS; CRACK GROWTH; CU FILMS; CU SURFACES; EXPERIMENTAL STUDIES; FINITE STRAINS; FLOW THEORIES; INTERFACE PATTERNS; INTERFACE TOUGHNESS; MACROSCOPIC CRACKS; MACROSCOPIC INTERFACES; MICRON SCALE; MIXED-MODE INTERFACE; NANO-METER-SCALE; PATTERN GEOMETRY; PATTERNED WAFERS; PLASTIC YIELDING; RESISTANCE CURVES; SI SUBSTRATES; SI WAFER; THEORETICAL STUDY; THERMOCOMPRESSION BONDS; THOMPSON; WAFER LEVEL; WORK OF SEPARATION;

COMPUTATIONAL GEOMETRY; CRACKING (CHEMICAL); CRACKS; METALLIC FILMS; PHOTORESISTS; PLASTICITY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THIN FILMS; WAFER BONDING;

COPPER;

EID: 67649637626     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2009.05.015     Document Type: Article

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