A new cycle test system emulating inductive switching waveforms

2007 European Conference on Power Electronics and Applications, EPE

Volumn , Issue , 2007, Pages

  Glavanovics, Michael ^a   Köck, Helmut ^a,b   Eder, Herbert ^b   Košel, Vladimir ^a,c   Smorodin, Tobias ^d,e  

^a Kompetenzzentrum Automobil und Industrie Elektronik Gmbh   (Austria)

^b CARINTHIA UNIVERSITY OF APPLIED SCIENCES   (Austria)

^c SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

^d UNIVERSITY OF FREIBURG   (Germany)

^e INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Automotive electronics; Diagnostics, measurement; MOSFET; Power cycling; Power integrated circuit; Power semiconductor device; Reliability; Robustness; Smart power; Thermal stress

Indexed keywords

AUTOMOTIVE ELECTRONICS; DIAGNOSTICS, MEASUREMENT; MOSFET; POWER CYCLING; POWER SEMICONDUCTOR DEVICE; ROBUSTNESS; SMART POWER;

AUTOMOBILE ELECTRONIC EQUIPMENT; FUNCTION EVALUATION; INTEGRATED CIRCUITS; LITHIUM BATTERIES; LOAD TESTING; MOSFET DEVICES; PHOTOLITHOGRAPHY; POWER INTEGRATED CIRCUITS; RELIABILITY; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SWITCHES; STRENGTH OF MATERIALS; TESTING; THERMAL STRESS; THERMOELASTICITY;

POWER ELECTRONICS;

EID: 67649416382     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPE.2007.4417742     Document Type: Conference Paper

References (12)

1. M. Glavanovics, H. Zitta, "Thermal Destruction Testing: an Indirect Approach to a Simple Dynamic Thermal Model of Smart Power Switches", ESSCIRC 2001, Proc. p.236 ff.
2. S. Foster et al, "Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects", Microelectronics reliability vol 41, p. 1677, Elsevier Science Ltd. 2001
3. M. Bosc et al, "Reliability Characterization of LDMOS Transistors submitted to Multiple Energy Discharges", ISPSD'2000 Proceedings, Cat.Nr.00CH37094C
4. AEC-Q 100-F.2, "Stress Test Qualification for Integrated Circuits", Automotive Electronics Council, 2003
5. Herbert Eder, ""Development of a Repetitive Clamping Test System Hardware for Smart Power Switches", Diploma thesis, Fachhochschule fur Elektronik Villach, Austria, 2006
6. Helmut Köck, "Development of Lab VIEW Realtime FPGA Software for Cycle Test Systems", Diploma thesis, Fachhochschule für Telematik Klagenfürt, Austria, 2006
7. P. E. Bagnoli et al, "Thermal Resistance Analysis by Induced Transient (TRAIT) Method for Power Electronic Devices Thermal Characterization" IEEE Trans, on Power Electronics, Vol.13, No.6, Nov. 1998.
8. Diebold, E.J., and Luft, W., "Transient Thermal Impedance of Semiconductor Devices", AIEE Trans., vol. 79, part J, p.719, 1961
9. M. Glavanovics, Th. Detzel, K. Weber, "Impact of Thermal Overload Operation on Wirebond and Metallization Reliability in Smart Power Devices", ESSDERC 2004, Leuven, Belgium
10. M. Bosc et al, "Thermal characterization of LDMOS transistors for accelerating stress testing", Microelectronics Journal 31, pp747-752, Elsevier Science Ltd. 2000
11. Marie Denison, "Single Stress Safe Operating Area of DMOS Transistors integrated in Smart Power Technologies", PhD thesis, University of Bremen, Germany, Shaker Verlag Aachen 2005
12. M. Denison, M. Pfost, K. Pieper, S. Märkl, D. Metzner, M. Stecher, "Influence of inhomogeneous current distribution on the thermal SOA of integrated DMOS transistors", ISPSD 2004, Kitakyushu, Japan