Preparation and properties for aluminum-doped zinc oxide powders with the coprecipitation method

Journal of the Ceramic Society of Japan

Volumn 117, Issue 1365, 2009, Pages 703-705

  Shui, Anze ^a   Wang, Shumei ^b   Wang, Hui ^a   Cheng, Xiaosu ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b HUNAN INSTITUTE OF HUMANITIES SCIENCE AND TECHNOLOGY   (China)

Author keywords

Aluminum; Conductive property; Coprecipitation method; Dopant; Zinc oxide

Indexed keywords

CALCINATION; COPRECIPITATION; DOPING (ADDITIVES); ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTIVITY MEASUREMENT; NITRATES; OPTICAL FILMS; POWDERS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY POWDER DIFFRACTION; ZINC; ZINC OXIDE;

ALUMINUM NITRATE; ALUMINUM-DOPED ZINC OXIDE; CALCINATION TEMPERATURE; CALCINATION TIME; CONDUCTIVE PROPERTIES; COPRECIPITATION METHOD; PROCESS PARAMETERS; ZINC OXIDE POWDER;

ALUMINUM;

EID: 67649372874     PISSN: 18820743     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj2.117.703     Document Type: Article

References (21)

1. K. Keis, C. Bauer, G. Boschloo, A. Hagfeldt, K. Westermark, H. Rensmo and H. Siegbahn, J. Photochemisity and Photobiology A:Chemical, 148, 57-64 (2002).
2. W. Q. Peng, S. C. Qu, G. W. Cong and Z. G. Wang, Cryst. Growth Des., 6[6], 1518-1522 (2006).
3. S. C. Navale, V. Ravi, D. Srinivas, I. S. Mulla, S. W. Gosavi and S. K. Kulkarni, Sensors and Actuators B-Chemical, 130[2], 668-673 (2008).
4. S. C. Navale, V. Ravi, I. S. Mulla, S. W. Gosavi and S. K. Kulkarni, Sensors and Actuators B-Chemical, 126[2], 382-386 (2007).
5. R. C. Chang, S. Y. Chu, P. W. Yeh, C. S. Hong, P. C. Kao and Y. J. Huang, Sensors and Actuators B-Chemical, 132[1], 290-295 (2008).
6. R. S. Mane, W. J. Lee, C. D. Lokhande, B. W. Cho and S. H. Han, Current Applied Physics, 8[5], 549-553 (2008).
7. P. D. Yang, H. Q. Yan, S. Mao, R. Russo, J. Johnson, R. Saykally, N. Morris, J. Pham, R. R. He and H. J. Choi, Adv. Funct. Mater., 12[5], 323-331 (2002).
8. D. R. Sahu, S. Y. Lin and J. L. Huang, Appl. Surf. Sci., 253[11], 4886-4890 (2007).
9. Z. W. Zhou, L. S. Chu, W. M. Tang and L. X. Gu, J. Electrostatics, 57[3], 347-354 (2003).
10. P. J. Kelly and Y. Zhou, J. Vac. Sci. Technol. A, 24[5], 1782-1789 (2006).
11. W. J. Jeong, S. K. Kim and G. C. Park, Thin Solid Films, 506, 180-183 (2006).
12. Z. Zhou, K. Kato, T. Komaki, M. Yoshino, H. Yukawa, M. Morinaga and K. Morita, J. Eur. Ceram. Soc., 24, 139-146 (2004).
13. S. Y. Bae, C. W. Na, J. H. Kang and J. Park, J. Phys. Chem. B, 109, 2526-2531 (2005).
14. Y. H. Hu, H. H. Zhang and H. M. Yang, J. Alloys Compd., 453[1-2], 292-297 (2008).
15. K. F. Cai, E. Muller, C. Drasar and A. Mrotzek, Materials Science and Engineering B-Solid State Materials for Advanced Technology, 104[1-2], 45-48 (2003).
16. R. R. Piticescu, R. M. Piticescu and C. J. Monty, J. Eur. Ceram. Soc., 26[14], 2979-2983 (2006).
17. J. P. Han, P. Q. Mantas and A. M. R. Senos, J. Eur. Ceram. Soc., 21 [10-11], 1883-1886 (2001).
18. J. Wu, Y. Zhong and D. Yan, J. South China Univ. of Tech., 35[5], 100-104 (2007).
19. F. Yuan, S. Huang, Y. Ling and J. Li, Engineering Chemistry & Metallurgy, 19[3], 212-216 (1998).
20. T. Seto, K. Okuyama and A. Hirota, J. Soc. Powder Tech., Japan, 33[3], 187-191 (1996).
21. F. Paraguay, J. Morales, W. Estrada, E. Andrade and M. Miki- Yoshida, Thin Solid Films, 366[1-2], 16-27 (2000).