Application of lithium niobate etch stop Technology to saw pressure sensors

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2008, Pages 1124-1127

  Randles, Andrew B ^a   Kuypers, Jan H ^a   Esashi, Masayoshi ^a   Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ETCH PROFILE; ETCH STOP; HERMETIC SEALING; LITHIUM NIOBATE; PROCESS TECHNOLOGIES; SAW PRESSURE SENSORS; SEALED CAVITIES; THERMAL INVERSION; THIN DIAPHRAGMS;

ACOUSTIC SURFACE WAVE DEVICES; DIAPHRAGMS; GOLD; LITHIUM; NIOBIUM COMPOUNDS; PRESSURE SENSORS; PRESSURE TRANSDUCERS;

WAFER BONDING;

EID: 67649305436     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2008.0271     Document Type: Conference Paper

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